|
MH8V725AZTJ-5 |
MH8V725AZTJ-6 |
Description |
EDO DRAM Module, 8MX72, 50ns, CMOS, DIMM-168 |
EDO DRAM Module, 8MX72, 60ns, CMOS, DIMM-168 |
Maker |
Mitsubishi |
Mitsubishi |
Parts packaging code |
DIMM |
DIMM |
package instruction |
DIMM, DIMM168 |
DIMM, DIMM168 |
Contacts |
168 |
168 |
Reach Compliance Code |
unknown |
unknow |
ECCN code |
EAR99 |
EAR99 |
access mode |
FAST PAGE WITH EDO |
FAST PAGE WITH EDO |
Maximum access time |
50 ns |
60 ns |
Other features |
CAS BEFORE RAS/HIDDEN REFRESH |
CAS BEFORE RAS/HIDDEN REFRESH |
I/O type |
COMMON |
COMMON |
JESD-30 code |
R-XDMA-N168 |
R-XDMA-N168 |
memory density |
603979776 bit |
603979776 bi |
Memory IC Type |
EDO DRAM MODULE |
EDO DRAM MODULE |
memory width |
72 |
72 |
Number of functions |
1 |
1 |
Number of ports |
1 |
1 |
Number of terminals |
168 |
168 |
word count |
8388608 words |
8388608 words |
character code |
8000000 |
8000000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
organize |
8MX72 |
8MX72 |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
DIMM |
DIMM |
Encapsulate equivalent code |
DIMM168 |
DIMM168 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
power supply |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
refresh cycle |
8192 |
8192 |
Maximum standby current |
0.0245 A |
0.0245 A |
Maximum slew rate |
1.19 mA |
1.1 mA |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
3 V |
3 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
surface mount |
NO |
NO |
technology |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal form |
NO LEAD |
NO LEAD |
Terminal pitch |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |