|
KA8511Q |
KA8510Q |
Description |
RF and Baseband Circuit, PQFP64, 14 X 20 MM, QFP-64 |
RF and Baseband Circuit, PQFP64, 14 X 20 MM, QFP-64 |
Is it lead-free? |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
SAMSUNG |
SAMSUNG |
Parts packaging code |
QFP |
QFP |
package instruction |
QFP, QFP64(UNSPEC) |
QFP, QFP64(UNSPEC) |
Contacts |
64 |
64 |
Reach Compliance Code |
compliant |
compli |
JESD-30 code |
R-PQFP-G64 |
R-PQFP-G64 |
JESD-609 code |
e0 |
e0 |
length |
20 mm |
20 mm |
Number of functions |
1 |
1 |
Number of terminals |
64 |
64 |
Maximum operating temperature |
75 °C |
75 °C |
Minimum operating temperature |
-25 °C |
-25 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
QFP |
QFP |
Encapsulate equivalent code |
QFP64(UNSPEC) |
QFP64(UNSPEC) |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
FLATPACK |
FLATPACK |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
2/6 V |
2/6 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
3 mm |
3 mm |
Nominal supply voltage |
3 V |
3 V |
surface mount |
YES |
YES |
Telecom integrated circuit types |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT |
Temperature level |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
1 mm |
1 mm |
Terminal location |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
14 mm |
14 mm |