M24C01-RMC6TP/S datasheet, PDF

Datasheet> All Categories > storage> storage> M24C01-RMC6TP/S

M24C01-RMC6TP/S: DescriptionSPI BUS SERIAL EEPROM; Categorystorage storage; File Size365KB，37 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

Download Datasheet Parametric Compare View All

M24C01-RMC6TP/S Overview

SPI BUS SERIAL EEPROM

M24C01-RMC6TP/S Parametric

Parameter Name	Attribute value
Maker	STMicroelectronics
package instruction	HVSON,
Reach Compliance Code	unknown
Maximum clock frequency (fCLK)	0.4 MHz
JESD-30 code	R-PDSO-N8
length	3 mm
memory density	1024 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	128 words
character code	128
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128X8
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL
Maximum seat height	0.6 mm
Serial bus type	SPI
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
width	2 mm
Maximum write cycle time (tWC)	5 ms
Base Number Matches	1

Preview

Download Datasheet

View All

M24C08-x M24C04-x M24C02-x M24C01-x

8-Kbit, 4-Kbit, 2-Kbit, and 1-Kbit serial I²C bus EEPROM

Datasheet

−

production data

Features

■

Supports both the 100 kHz I

C Standard-mode

and the 400 kHz I

C Fast-mode

Single supply voltage:

– 2.5 V to 5.5 V for M24Cxx-W

– 1.8 V to 5.5 V for M24Cxx

– 1.7 V to 5.5 V for M24Cxx-F

Write Control input

Byte and Page Write (up to 8 bytes)

Random and Sequential Read modes

Self-timed programming cycle

Automatic address incrementing

Enhanced ESD/latch-up protection

More than 1 million write cycles

More than 40-year data retention

Packages:

– SO8, TSSOP8, UFDFPN8: ECOPACK2

(RoHS-compliant and Halogen-free)

– PDIP8: ECOPACK1

(RoHS-compliant)

Device summary

Reference

Part number

M24C08-W

M24C08-x

M24C08-R

M24C08-F

M24C04-W

M24C04-x

M24C04-R

M24C04-F

M24C02-W

M24C02-x

M24C02-R

M24C01-W

M24C01-x

M24C01-R

1. Only M24C08-F devices are offered in the WLCSP

package.

2. Only M24C08-F devices are offered in the Thin

WLCSP package.

PDIP8 (BN)

■

SO8 (MN)

150 mils width

TSSOP8 (DW)

169 mils width

Table 1.

UFDFPN8 (MB, MC)

2 × 3 mm (MLP)

WLCSP (CS)

Thin WLCSP (CT)

July 2012

This is information on a product in full production.

Doc ID 5067 Rev 18

1/37

www.st.com

Contents

M24C08-x M24C04-x M24C02-x M24C01-x

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3.1

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.4.1

2.4.2

2.4.3

2.4.4

Operating supply voltage V

CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1

3.2

3.3

3.4

3.5

3.6

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.6.1

3.6.2

3.6.3

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . 15

3.7

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.7.1

3.7.2

3.7.3

3.7.4

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2/37

Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Doc ID 5067 Rev 18

List of tables

M24C08-x M24C04-x M24C02-x M24C01-x

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Operating conditions (M24Cxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Operating conditions (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Operating conditions (M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

DC characteristics (M24Cxx-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DC characteristics (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

DC characteristics (M24Cxx-F). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

AC characteristics at 400 kHz (I

C Fast mode) (M24Cxx-W,

M24Cxx-R, M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

AC characteristics at 100 kHz (I

C Standard mode) (M24Cxx-W,

M24Cxx-R, M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

M24C08: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data . . . . . . . . . . . . 26

M24C08: Thin WLCSP (0.3 mm height), 0.4 mm pitch, 5 bumps, package data . . . . . . . . 27

SO8 narrow – 8 lead plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

TSSOP8 – 8 lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 30

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 31

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

4/37

Doc ID 5067 Rev 18

M24C08-x M24C04-x M24C02-x M24C01-x

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

WLCSP and thin WLCSP connections

(top view, marking side, with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

C Fast mode (f

= 400 kHz): maximum Rbus value versus bus parasitic

capacitance (C

bus

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

I²C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 13

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps,

package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 28

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 30

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 31

Doc ID 5067 Rev 18

5/37

M24C01-RMC6TP/S Related Products

	M24C01-RMC6TP/S	M24C04-WMC6TP/S	M24C08-FMB5TP/S	M24C04-RMB5TP/S	M24C04-RMC6TP/S	M24C02-RMC6TP/S	M24C02-RMC5TP/S	M24C01-WMC6TP/S	M24C08-FMC5TP/S
Description	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM	SPI BUS SERIAL EEPROM
package instruction	HVSON,	HVSON,	HVSON,	,	HVSON,	HVSON,	,	HVSON,	HVSON,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
Serial bus type	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI
Maker	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Maximum clock frequency (fCLK)	0.4 MHz	0.4 MHz	0.4 MHz	-	0.4 MHz	0.4 MHz	-	0.4 MHz	0.4 MHz
JESD-30 code	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	-	R-PDSO-N8	R-PDSO-N8	-	R-PDSO-N8	R-PDSO-N8
length	3 mm	3 mm	3 mm	-	3 mm	3 mm	-	3 mm	3 mm
memory density	1024 bit	4096 bit	8192 bit	-	4096 bit	2048 bit	-	1024 bit	8192 bit
memory width	8	8	8	-	8	8	-	8	8
Number of functions	1	1	1	-	1	1	-	1	1
Number of terminals	8	8	8	-	8	8	-	8	8
word count	128 words	512 words	1024 words	-	512 words	256 words	-	128 words	1024 words
character code	128	512	1000	-	512	256	-	128	1000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	-	85 °C	85 °C	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-20 °C	-	-40 °C	-40 °C	-	-40 °C	-20 °C
organize	128X8	512X8	1KX8	-	512X8	256X8	-	128X8	1KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVSON	HVSON	HVSON	-	HVSON	HVSON	-	HVSON	HVSON
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	-	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	-	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL	SERIAL	SERIAL	-	SERIAL	SERIAL	-	SERIAL	SERIAL
Maximum seat height	0.6 mm	0.6 mm	0.6 mm	-	0.6 mm	0.6 mm	-	0.6 mm	0.6 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V	-	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	2.5 V	1.7 V	-	1.8 V	1.8 V	-	2.5 V	1.7 V
surface mount	YES	YES	YES	-	YES	YES	-	YES	YES
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	OTHER	-	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	OTHER
Terminal form	NO LEAD	NO LEAD	NO LEAD	-	NO LEAD	NO LEAD	-	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	-	0.5 mm	0.5 mm	-	0.5 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	-	DUAL	DUAL	-	DUAL	DUAL
width	2 mm	2 mm	2 mm	-	2 mm	2 mm	-	2 mm	2 mm
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	-	5 ms	5 ms	-	5 ms	5 ms

Recommended Resources

DC motor reverse braking circuit

CXA1034P, M power amplifier circuit diagram

Ventilation fan automatic controller circuit.gif

High-speed switch with clamping diode

RCC mode switching power supply circuit diagram

Precision voltage-frequency conversion circuit diagram

CC3200 Kit OURS-SDK-WFB_Explore - by tinnu: [index] [#]CC3200 kit OURS-SDK-WFB_Exploration [#1068424,2843132]CC3200 kit - OURS-SDK-WFB Getting Started [#1068977,2845381]CC3200 kit OURS-SDK-WFB_Exploration 2 [#1068980,2845410]CC3200 kit OURS-SDK...; okhxyyo Wireless Connectivity

RISC-V IDE MRS Usage Notes (IV): Link-time Optimization: Link-time optimization, or LTO (Link Time Optimization), is partially introduced as follows (for details, please refer to the GCC document on FLTO): When called with source code, it generates GIMPLE (...; Moiiiiilter MCU

Xunwei 3399 development board-PCIE 4G module test-compiler: 1. First copy ppp-2.4.7.tar.gz to Ubuntu, then execute the following command to decompress it: tar -xvf ppp-2.4.7.tar.gz DecompressionAfter completion, you will get the ppp-2.4.7 directory. Enter the ...; 遥寄山川 ARM Technology

【CH579M-R1】+DHT22 temperature and humidity detection: The previous section mainly introduced the use of sensors based on analog signals. This time, let’s talk about the use of digital sensors. There are many types of digital sensors. Such as temperature ...; jinglixixi Domestic Chip Exchange

【BLE 5.3 wireless MCU CH582】13. Power consumption in BLE Peripheral mode: Series of articles: 【BLE 5.3 wireless MCU CH582】1. Getting to know the CH582 development board (unboxing) 【BLE 5.3 wireless MCU CH582】2. MounRiver IDE first experience 【BLE 5.3 wireless MCU CH582】3. N...; freeelectron Domestic Chip Exchange

CircuitPython Online Editor: ObjectiveProvide a zero-setup CircuitPython Python IDE that helpsAnyone who wants to quickly start a project People working on public computers Distance education, teachers don't want students to inst...; dcexpert MicroPython Open Source section

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components