SEAMP–20–02.0–L–06
F-215
SEAMI–50–11.0–L–10–2–A–K–TR
Press fit
tails
(1,27 mm) .050"
SEAMP, SEAMI SERIES
HIGH SPEED/HIGH DENSITY OPEN PIN FIELD
Mates with:
SEAF, SEAF-RA-GP
SEAMP
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAMP
Insulator Material:
Natural LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55°C to +125°C
Current Rating:
2.5 A per pin
(6 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1,27 µm) Ni
Contact Resistance:
8.7 mΩ
Working Voltage:
215 VAC
RoHS Compliant:
Yes
NO. OF POSITIONS
PER ROW
02.0
PLATING
OPTION
NO. OF
ROWS
OPTION
–L
SEAMP
= Press Fit
NO. OF
ROWS
–04
–06
–08
–10
No. of positions x
(1,27) .050 + (5,18) .204
– 04
= Four Rows
–10, – 20, – 30, –40, –50
B
= 10 µ" (0,25 µm)
Gold on
contact area,
Matte Tin on tail
– GP
= Guide
Post
(Mates with
SEAF-RA-
GP only)
– 06
= Six Rows
A
(7,06)
.278
(9,60)
.378
(12,14)
.478
(14,68)
.578
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
(2,54)
.100
(2,54)
.100
(5,08)
.200
(7,62)
.300
–S
A
B
= 30 µ" (0,76 µm)
Gold on
contact area,
Matte Tin on tail
– 08
= Eight Rows
– TR
= Tape
& Reel
– 10
= Ten Rows
(1,27) .050
MATED HEIGHTS*
SEAMP SEAF LEAD STYLE
LEAD
STYLE –05.0 –06.0 –06.5
–02.0
7 mm 8 mm 8.5 mm
Note:
Compliant pin fixture
*Processing conditions will
affect mated height.
CAT-SEAMP-XX-XX.
Patent Pending.
(1,23)
.048
(0,59) .023
No. of positions x
(1,27) .050 - (1,27) .050
SEAMP/SEAF-RA
Rated @ 3dB Insertion Loss*
Single-Ended Signaling
11 GHz / 22 Gbps
11 GHz / 22 Gbps
(4,60)
Differential Pair Signaling
.181
*Test board losses de-embedded from performance data.
Complete test data available at www.samtec.com?SEAMP
or contact sig@samtec.com
Processing:
Application tooling and one ton
(1,78)
minimum press required. Contact ATG@samtec.com
.070
for more information.
Mates with:
SEAF
SEAMI
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAMI
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
Testing Now!
Plating:
NO. OF
Au or Sn over
ROWS
50 µ" (1,27 µm) Ni
–08
Contact
Resistance:
–10
Testing Now!
Working Voltage:
Testing Now!
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
NO. PINS
PER ROW
11.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
K
–A
TR
–L
SEAMI
= 85Ω tuned
No. of positions x
(1,27) .050 + (4,98) .196
–40, –50
= 10 µ"
(0,25 µm)
Gold on
contact area,
Matte Tin on
solder tail
– 08
=Eight Rows
–1
= Tin/Lead
Alloy
Solder
Charge
= Alignment Pins
– 10
=Ten Rows
–K
= Polyimide film
Pick & Place Pad
–2
= Lead-Free
Solder
Charge
A
(13,41)
.528
(15,95)
.628
B
(5,08)
.200
(7,62)
.300
01
–S
A
– TR
=Tape & Reel
B
= 30 µ"
(0,76 µm)
Gold on
contact area,
Matte Tin on
solder tail
ALSO AVAILABLE
(MOQ Required)
• Other plating options
• 20 & 30 pins per row
• 04 & 06 rows
Contact Samtec.
08
MATED HEIGHTS*
SEAMI SEAF LEAD STYLE
LEAD
STYLE –05.0 –06.0 –06.5
–11.0
16 mm 17 mm 17.5 mm
*Processing conditions will
affect mated height.
(14,66)
.577
Note:
Patented
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
(1,12)
.044
DIA
(1,27) .050
(0,86)
No. of positions x .034
(1,27) .050 + (3,58) .141
SEAMI/SEAF
Rated @ 3dB Insertion Loss*
16 mm Stack Height
Single-Ended Signaling
14 GHz / 28 Gbps
Differential Pair Signaling
16.5 GHz / 33 Gbps
*Test board losses de-embedded from performance data.
Complete test data available at www.samtec.com?SEAMI
or contact sig@samtec.com
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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