Cache SRAM, 2MX36, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | GSI Technology |
Parts packaging code | BGA |
package instruction | BGA, |
Contacts | 165 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 6.5 ns |
Other features | PIPELINED OR FLOW-THROUGH ARCHITECTURE |
JESD-30 code | R-PBGA-B165 |
length | 17 mm |
memory density | 75497472 bit |
Memory IC Type | CACHE SRAM |
memory width | 36 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 165 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX36 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 2 V |
Minimum supply voltage (Vsup) | 1.6 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15 mm |
Base Number Matches | 1 |