Flash, 8MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Microsemi |
| Parts packaging code | BGA |
| package instruction | BGA, |
| Contacts | 159 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.1.A |
| Maximum access time | 120 ns |
| Other features | ALSO CONFIGURABLE AS 2 X 8M X 32, OR 4 X 8M X 16 |
| JESD-30 code | R-PBGA-B159 |
| memory density | 536870912 bit |
| Memory IC Type | FLASH |
| memory width | 64 |
| Number of functions | 1 |
| Number of terminals | 159 |
| word count | 8388608 words |
| character code | 8000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 8MX64 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Programming voltage | 3.3 V |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
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