Flash, 1GX8, 20ns, PDSO48
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Micron Technology |
| Reach Compliance Code | unknown |
| Maximum access time | 20 ns |
| command user interface | YES |
| Data polling | NO |
| JESD-30 code | R-PDSO-G48 |
| memory density | 8589934592 bit |
| Memory IC Type | FLASH |
| memory width | 8 |
| Number of departments/size | 8K |
| Number of terminals | 48 |
| word count | 1073741824 words |
| character code | 1000000000 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 1GX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP48,.8,20 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| page size | 2K words |
| Parallel/Serial | PARALLEL |
| power supply | 3/3.3 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Department size | 128K |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.03 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| switch bit | NO |
| type | NAND TYPE |
| Base Number Matches | 1 |
| NAND08GW3C2AN6F | NAND08GW3C2AN1F | NAND08GW3C2AN1E | |
|---|---|---|---|
| Description | Flash, 1GX8, 20ns, PDSO48 | Flash, 1GX8, 20ns, PDSO48 | Flash, 1GX8, 20ns, PDSO48 |
| Is it Rohs certified? | conform to | conform to | conform to |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum access time | 20 ns | 20 ns | 20 ns |
| command user interface | YES | YES | YES |
| Data polling | NO | NO | NO |
| JESD-30 code | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
| memory density | 8589934592 bit | 8589934592 bit | 8589934592 bit |
| Memory IC Type | FLASH | FLASH | FLASH |
| memory width | 8 | 8 | 8 |
| Number of departments/size | 8K | 8K | 8K |
| Number of terminals | 48 | 48 | 48 |
| word count | 1073741824 words | 1073741824 words | 1073741824 words |
| character code | 1000000000 | 1000000000 | 1000000000 |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C |
| organize | 1GX8 | 1GX8 | 1GX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | TSSOP | TSSOP |
| Encapsulate equivalent code | TSSOP48,.8,20 | TSSOP48,.8,20 | TSSOP48,.8,20 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| page size | 2K words | 2K words | 2K words |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| power supply | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| ready/busy | YES | YES | YES |
| Department size | 128K | 128K | 128K |
| Maximum standby current | 0.00005 A | 0.00005 A | 0.00005 A |
| Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | DUAL | DUAL | DUAL |
| switch bit | NO | NO | NO |
| type | NAND TYPE | NAND TYPE | MLC NAND TYPE |
| Maker | Micron Technology | - | Micron Technology |
| Base Number Matches | 1 | 1 | - |
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