Fast Page DRAM Module, 4MX32, 70ns, CMOS, DIMM-72
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Micron Technology |
Parts packaging code | DIMM |
package instruction | DIMM-72 |
Contacts | 72 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 70 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
Spare memory width | 16 |
I/O type | COMMON |
JESD-30 code | R-XDMA-N72 |
memory density | 134217728 bit |
Memory IC Type | FAST PAGE DRAM MODULE |
memory width | 32 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 72 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX32 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM72 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 2048 |
Maximum seat height | 25.654 mm |
self refresh | NO |
Maximum standby current | 0.004 A |
Maximum slew rate | 0.88 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |
MT8LDT432HG-7 | MT8LDT432HG-6L | MT8LDT432HG-6XL | MT8LDT432HG-7XL | MT8LDT432HG-7S | MT8LDT432HG-7X | MT8LDT432HG-7L | |
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Description | Fast Page DRAM Module, 4MX32, 70ns, CMOS, DIMM-72 | Fast Page DRAM Module, 4MX32, 60ns, CMOS, DIMM-72 | EDO DRAM Module, 4MX32, 60ns, CMOS, DIMM-72 | EDO DRAM Module, 4MX32, 70ns, CMOS, DIMM-72 | Fast Page DRAM Module, 4MX32, 70ns, CMOS, DIMM-72 | EDO DRAM Module, 4MX32, 70ns, CMOS, DIMM-72 | Fast Page DRAM Module, 4MX32, 70ns, CMOS, DIMM-72 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
Parts packaging code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
package instruction | DIMM-72 | DIMM-72 | DIMM-72 | DIMM-72 | DIMM-72 | DIMM-72 | DIMM-72 |
Contacts | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | FAST PAGE | FAST PAGE | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE | FAST PAGE WITH EDO | FAST PAGE |
Maximum access time | 70 ns | 60 ns | 60 ns | 70 ns | 70 ns | 70 ns | 70 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
Spare memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-XDMA-N72 | R-XDMA-N72 | R-XDMA-N72 | R-XDMA-N72 | R-XDMA-N72 | R-XDMA-N72 | R-XDMA-N72 |
memory density | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | FAST PAGE DRAM MODULE | EDO DRAM MODULE | FAST PAGE DRAM MODULE |
memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 4MX32 | 4MX32 | 4MX32 | 4MX32 | 4MX32 | 4MX32 | 4MX32 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
Encapsulate equivalent code | DIMM72 | DIMM72 | DIMM72 | DIMM72 | DIMM72 | DIMM72 | DIMM72 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
Maximum seat height | 25.654 mm | 25.654 mm | 25.654 mm | 25.654 mm | 25.654 mm | 25.654 mm | 25.654 mm |
self refresh | NO | NO | NO | NO | YES | NO | NO |
Maximum standby current | 0.004 A | 0.0012 A | 0.0012 A | 0.0012 A | 0.0012 A | 0.004 A | 0.0012 A |
Maximum slew rate | 0.88 mA | 0.96 mA | 0.96 mA | 0.88 mA | 0.88 mA | 0.88 mA | 0.88 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |