N27960K1-16 datasheet, PDF - EEWORLD Datasheet

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N27960K1-16: DescriptionOTP ROM, 128KX8, 16ns, CMOS, PQCC44, 0.650 X 0.650 INCH, PLASTIC, LCC-44; Categorystorage storage; File Size560KB，19 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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N27960K1-16 Overview

OTP ROM, 128KX8, 16ns, CMOS, PQCC44, 0.650 X 0.650 INCH, PLASTIC, LCC-44

N27960K1-16 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	LCC
package instruction	QCCJ, LDCC44,.7SQ
Contacts	44
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	16 ns
I/O type	COMMON
JESD-30 code	S-PQCC-J44
JESD-609 code	e0
length	16.5862 mm
memory density	1048576 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	44
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC44,.7SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum slew rate	0.125 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16.5862 mm
Base Number Matches	1

N27960K1-16 Related Products

	N27960K1-16	CJ27960K2-20	CJ27960K1-20	CJ27960K2-25	CJ27960K1-16
Description	OTP ROM, 128KX8, 16ns, CMOS, PQCC44, 0.650 X 0.650 INCH, PLASTIC, LCC-44	UVPROM, 128KX8, 20ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44	UVPROM, 128KX8, 20ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44	UVPROM, 128KX8, 25ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44	UVPROM, 128KX8, 16ns, CMOS, CQCC44, 0.650 X 0.650 INCH, CERQUAD-44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	LCC	QFN	QFN	QFN	QFN
package instruction	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ
Contacts	44	44	44	44	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	16 ns	20 ns	20 ns	25 ns	16 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PQCC-J44	S-CQCC-J44	S-CQCC-J44	S-CQCC-J44	S-CQCC-J44
JESD-609 code	e0	e0	e0	e0	e0
length	16.5862 mm	16.51 mm	16.51 mm	16.51 mm	16.51 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	OTP ROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	44	44	44	44	44
word count	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm
Maximum slew rate	0.125 mA	0.125 mA	0.125 mA	0.125 mA	0.125 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	16.5862 mm	16.51 mm	16.51 mm	16.51 mm	16.51 mm
Maker	-	-	Intel	Intel	Intel

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