DSP-ADDRESS SEQUENCER, PDSO14, PLASTIC, MS-012AB, SOIC-14
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Parts packaging code | SOIC |
package instruction | SOP, |
Contacts | 14 |
Reach Compliance Code | compliant |
boundary scan | NO |
JESD-30 code | R-PDSO-G14 |
JESD-609 code | e3 |
length | 8.65 mm |
low power mode | NO |
Humidity sensitivity level | 2 |
Number of terminals | 14 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
Maximum supply voltage | 24 V |
Minimum supply voltage | 2.5 V |
Nominal supply voltage | 12 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 3.9 mm |
uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, ADDRESS SEQUENCER |
Base Number Matches | 1 |
ISL8704IBZ | ISL8705IBZ | ISL8705IBZT | ISL8701IBZT | ISL8700IBZT | ISL8704IBZT | ISL8702IBZT | ISL8703IBZT | ISL8703IBZ | |
---|---|---|---|---|---|---|---|---|---|
Description | DSP-ADDRESS SEQUENCER, PDSO14, PLASTIC, MS-012AB, SOIC-14 | DSP-ADDRESS SEQUENCER, PDSO14, PLASTIC, MS-012AB, SOIC-14 | DSP-ADDRESS SEQUENCER, PDSO14, PLASTIC, MS-012AB, SOIC-14 | IC DSP-ADDRESS SEQUENCER, PDSO14, PLASTIC, MS-012AB, SOIC-14, DSP Peripheral | IC DSP-ADDRESS SEQUENCER, PDSO14, PLASTIC, MS-012AB, SOIC-14, DSP Peripheral | DSP-ADDRESS SEQUENCER, PDSO14, PLASTIC, MS-012AB, SOIC-14 | IC DSP-ADDRESS SEQUENCER, PDSO14, PLASTIC, MS-012AB, SOIC-14, DSP Peripheral | DSP-ADDRESS SEQUENCER, PDSO14, PLASTIC, MS-012AB, SOIC-14 | DSP-ADDRESS SEQUENCER, PDSO14, PLASTIC, MS-012AB, SOIC-14 |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
package instruction | SOP, | SOP, | SOP, | PLASTIC, MS-012AB, SOIC-14 | PLASTIC, MS-012AB, SOIC-14 | SOP, | SOP, | SOP, | SOP, |
Contacts | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
boundary scan | NO | NO | NO | NO | NO | NO | NO | NO | NO |
JESD-30 code | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
length | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm |
low power mode | NO | NO | NO | NO | NO | NO | NO | NO | NO |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
Maximum supply voltage | 24 V | 24 V | 24 V | 24 V | 24 V | 24 V | 24 V | 24 V | 24 V |
Minimum supply voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
Nominal supply voltage | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
width | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, ADDRESS SEQUENCER | DSP PERIPHERAL, ADDRESS SEQUENCER | DSP PERIPHERAL, ADDRESS SEQUENCER | DSP PERIPHERAL, ADDRESS SEQUENCER | DSP PERIPHERAL, ADDRESS SEQUENCER | DSP PERIPHERAL, ADDRESS SEQUENCER | DSP PERIPHERAL, ADDRESS SEQUENCER | DSP PERIPHERAL, ADDRESS SEQUENCER | DSP PERIPHERAL, ADDRESS SEQUENCER |
technology | CMOS | CMOS | CMOS | - | - | CMOS | - | CMOS | CMOS |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
Maker | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | - | - | Renesas Electronics Corporation | Renesas Electronics Corporation |