ATM/SONET/SDH IC, BICMOS, PQFP52,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | QFP, QFP52,.52SQ |
Reach Compliance Code | unknown |
JESD-30 code | S-PQFP-G52 |
JESD-609 code | e0 |
Number of terminals | 52 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP52,.52SQ |
Package shape | SQUARE |
Package form | FLATPACK |
power supply | 3.3,5 V |
Certification status | Not Qualified |
Maximum slew rate | 125 mA |
surface mount | YES |
technology | BICMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.635 mm |
Terminal location | QUAD |
Base Number Matches | 1 |
GD16367B-52BA | GD16368B-52BA | |
---|---|---|
Description | ATM/SONET/SDH IC, BICMOS, PQFP52, | ATM/SONET/SDH IC, BICMOS, PQFP52, |
Is it Rohs certified? | incompatible | incompatible |
package instruction | QFP, QFP52,.52SQ | QFP, QFP52,.52SQ |
Reach Compliance Code | unknown | unknown |
JESD-30 code | S-PQFP-G52 | S-PQFP-G52 |
JESD-609 code | e0 | e0 |
Number of terminals | 52 | 52 |
Maximum operating temperature | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | QFP |
Encapsulate equivalent code | QFP52,.52SQ | QFP52,.52SQ |
Package shape | SQUARE | SQUARE |
Package form | FLATPACK | FLATPACK |
power supply | 3.3,5 V | 3.3,5 V |
Certification status | Not Qualified | Not Qualified |
Maximum slew rate | 125 mA | 210 mA |
surface mount | YES | YES |
technology | BICMOS | BICMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING |
Terminal pitch | 0.635 mm | 0.635 mm |
Terminal location | QUAD | QUAD |
Base Number Matches | 1 | 1 |