DATACOM, FRAMER, PQFP144, TQFP-144
Parameter Name | Attribute value |
package instruction | LFQFP, |
Reach Compliance Code | unknown |
JESD-30 code | S-PQFP-G144 |
JESD-609 code | e0 |
length | 20 mm |
Number of functions | 1 |
Number of terminals | 144 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFQFP |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 225 |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | FRAMER |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 20 mm |
Base Number Matches | 1 |
T-7633---TL-DB | |
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Description | DATACOM, FRAMER, PQFP144, TQFP-144 |
package instruction | LFQFP, |
Reach Compliance Code | unknown |
JESD-30 code | S-PQFP-G144 |
JESD-609 code | e0 |
length | 20 mm |
Number of functions | 1 |
Number of terminals | 144 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFQFP |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 225 |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | FRAMER |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 20 mm |
Base Number Matches | 1 |