Support Circuit, 4 X 4 MM, MO-220, QFN-16
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | QFN |
| package instruction | HVQCCN, |
| Contacts | 16 |
| Reach Compliance Code | compliant |
| JESD-30 code | S-XQCC-N16 |
| JESD-609 code | e0 |
| length | 4 mm |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 80 °C |
| Minimum operating temperature | -30 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| Telecom integrated circuit types | SUPPORT CIRCUIT |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 4 mm |
| Base Number Matches | 1 |
| T7031-PEQ | T7031-PEPM | T7031-PEQM | |
|---|---|---|---|
| Description | Support Circuit, 4 X 4 MM, MO-220, QFN-16 | Support Circuit, 4 X 4 MM, LEAD AND HALOGEN FREE, MO-220, QFN-16 | Support Circuit, 4 X 4 MM, LEAD AND HALOGEN FREE, MO-220, QFN-16 |
| Is it lead-free? | Contains lead | Lead free | Lead free |
| Is it Rohs certified? | incompatible | conform to | conform to |
| Parts packaging code | QFN | QFN | QFN |
| package instruction | HVQCCN, | HVQCCN, | HVQCCN, |
| Contacts | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant |
| JESD-30 code | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 |
| JESD-609 code | e0 | e4 | e3 |
| length | 4 mm | 4 mm | 4 mm |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 |
| Maximum operating temperature | 80 °C | 80 °C | 80 °C |
| Minimum operating temperature | -30 °C | -30 °C | -30 °C |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | HVQCCN | HVQCCN | HVQCCN |
| Package shape | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 240 | 260 | 260 |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1 mm | 1 mm | 1 mm |
| Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES |
| Telecom integrated circuit types | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT |
| Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| Terminal surface | TIN LEAD | NICKEL PALLADIUM GOLD | MATTE TIN |
| Terminal form | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm |
| Terminal location | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | 30 | 40 | 40 |
| width | 4 mm | 4 mm | 4 mm |
| Base Number Matches | 1 | 1 | 1 |
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