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TSI574-10GCLV

Description
Telecom Circuit, 1-Func, CBGA399, 21 X 21 MM, GREEN, CERAMIC HSBGA-399
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,84 Pages
ManufacturerTundra Semiconductor Corp
Environmental Compliance
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TSI574-10GCLV Overview

Telecom Circuit, 1-Func, CBGA399, 21 X 21 MM, GREEN, CERAMIC HSBGA-399

TSI574-10GCLV Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instruction21 X 21 MM, GREEN, CERAMIC HSBGA-399
Reach Compliance Codeunknown
JESD-30 codeS-CBGA-B399
JESD-609 codee1
length21 mm
Humidity sensitivity level3
Number of functions1
Number of terminals399
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeHBGA
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Nominal supply voltage1.2 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelCOMMERCIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width21 mm
Base Number Matches1
Title
Tsi574 Serial RapidIO Switch
Hardware Manual
Final
November 2007
80B8050_MA001_02

TSI574-10GCLV Related Products

TSI574-10GCLV TSI574-10GCL TSI574-10GILV TSI574-10GIL
Description Telecom Circuit, 1-Func, CBGA399, 21 X 21 MM, GREEN, CERAMIC HSBGA-399 Telecom Circuit, 1-Func, CBGA399, 21 X 21 MM, CERAMIC HSBGA-399 Telecom Circuit, 1-Func, CBGA399, 21 X 21 MM, GREEN, CERAMIC HSBGA-399 Telecom Circuit, 1-Func, CBGA399, 21 X 21 MM, CERAMIC HSBGA-399
Is it Rohs certified? conform to incompatible conform to incompatible
package instruction 21 X 21 MM, GREEN, CERAMIC HSBGA-399 21 X 21 MM, CERAMIC HSBGA-399 21 X 21 MM, GREEN, CERAMIC HSBGA-399 21 X 21 MM, CERAMIC HSBGA-399
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code S-CBGA-B399 S-CBGA-B399 S-CBGA-B399 S-CBGA-B399
JESD-609 code e1 e0 e1 e0
length 21 mm 21 mm 21 mm 21 mm
Humidity sensitivity level 3 3 3 3
Number of functions 1 1 1 1
Number of terminals 399 399 399 399
Maximum operating temperature 70 °C 70 °C 85 °C 85 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code HBGA HBGA HBGA HBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER TIN LEAD TIN SILVER COPPER TIN LEAD
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 21 mm 21 mm 21 mm 21 mm
Base Number Matches 1 1 1 1

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