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VMD-2Q-2.0G

Description
VECTOR MODULATOR
File Size178KB,5 Pages
ManufacturerMerrimac Industries(Crane)
Websitehttp://www.craneae.com/
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VMD-2Q-2.0G Overview

VECTOR MODULATOR

VMD-2Q-2.0G (2.14 GHz)
VECTOR MODULATOR
REV: 003, 08/23/02
2.04 - 2.24 GHz
30 dB ATTENUATION RANGE
360 DEGREE PHASE RANGE
SURFACE MOUNT
TAPE & REEL
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX® Q-SERIES VECTOR MODULATORS
The Multi-Mix® VMD-Q series provides a vector modulator with variable IQ control of phase and
amplitude in a surface mount outline. Accurate phase and amplitude control through a 360 degree
range make them ideal for feed forward and signal processing applications.
VMD-Q vector modulators are fusion bonded multilayer stripline assemblies. The fusion bonding
process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical
performance that is superior to conventional adhesive bonding techniques.
The VMD-Q series is an easy to install SMD designed specifically for the full spectrum of wireless
applications. The high stability ceramic filled PTFE dielectrics utilized in these components are
compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground
plane provides excellent EM shielding.
Additional benefits include:
• Available on tape and reel
• Cost effective for commercial wireless applications
• Surface mount outline
• Operating temperature range –55°C to +85°C.
• Can be integrated with other Multi-Mix® components in a multi-function module
AVAILABLE ON
TAPE & REEL
RELIABILITY
The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,
Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life
Test (>1000 cycles).
THE MULTI-MIX® PROCESS
Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-
lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded
layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-
through vias to form a SMD module that requires no additional packaging and is suitable for automated
assembly.
THE MULTI-MIX MICROTECHNOLOGY
®
GROUP IS ISO-9001 REGISTERED
U.S. patent 6,099,677 and other patents pending.
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com

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