Non-Volatile SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP24,.6 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 45 ns |
JESD-30 code | R-PDIP-T24 |
JESD-609 code | e0 |
length | 31.95 mm |
memory density | 16384 bit |
Memory IC Type | NON-VOLATILE SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 24 |
word count | 2048 words |
character code | 2000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 2KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.1 mm |
Maximum standby current | 0.003 A |
Maximum slew rate | 0.08 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
Base Number Matches | 1 |
U635H16BDK45 | U635H16BDK35 | U635H16BDC25G1 | U635H16BSC35G1 | U635H16BDK25 | U635H16BDK25G1 | U635H16BDC45G1 | U635H16BDC35 | U635H16BDC45 | U635H16BSK35 | |
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Description | Non-Volatile SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Non-Volatile SRAM, 2KX8, 35ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Non-Volatile SRAM, 2KX8, 25ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Non-Volatile SRAM, 2KX8, 35ns, CMOS, PDSO24, 0.300 INCH, SOP-24 | Non-Volatile SRAM, 2KX8, 25ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Non-Volatile SRAM, 2KX8, 25ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Non-Volatile SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Non-Volatile SRAM, 2KX8, 35ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Non-Volatile SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Non-Volatile SRAM, 2KX8, 35ns, CMOS, PDSO24, 0.300 INCH, SOP-24 |
Is it Rohs certified? | incompatible | incompatible | conform to | conform to | incompatible | conform to | conform to | incompatible | incompatible | incompatible |
package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | SOP, SOP24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | SOP, SOP24,.4 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 45 ns | 35 ns | 25 ns | 35 ns | 25 ns | 25 ns | 45 ns | 35 ns | 45 ns | 35 ns |
JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 |
JESD-609 code | e0 | e0 | e3 | e3 | e0 | e3 | e3 | e0 | e0 | e0 |
length | 31.95 mm | 31.95 mm | 31.95 mm | 15.4 mm | 31.95 mm | 31.95 mm | 31.95 mm | 31.95 mm | 31.95 mm | 15.4 mm |
memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bi |
Memory IC Type | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | SOP | DIP | DIP | DIP | DIP | DIP | SOP |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | SOP24,.4 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | SOP24,.4 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 | 240 | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED | NOT SPECIFIED | 240 | 240 | 240 |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.1 mm | 5.1 mm | 5.1 mm | 2.65 mm | 5.1 mm | 5.1 mm | 5.1 mm | 5.1 mm | 5.1 mm | 2.65 mm |
Maximum standby current | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A | 0.003 A |
Maximum slew rate | 0.08 mA | 0.085 mA | 0.09 mA | 0.08 mA | 0.095 mA | 0.095 mA | 0.075 mA | 0.08 mA | 0.075 mA | 0.085 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | YES | NO | NO | NO | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 15.24 mm | 15.24 mm | 7.5 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 7.5 mm |