Flash, 64MX16, 35ns, PBGA63, 9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | BGA |
package instruction | TFBGA, |
Contacts | 63 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.1.A |
Maximum access time | 35 ns |
JESD-30 code | R-PBGA-B63 |
length | 11 mm |
memory density | 1073741824 bit |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 63 |
word count | 67108864 words |
character code | 64000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 64MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | NAND TYPE |
width | 9 mm |
Base Number Matches | 1 |