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D2525P30

Description
Support Circuit, 1-Func, HEAT SINK, HERMETIC SEALED, BUTTERFLY PACKAGE-14
CategoryWireless rf/communication    Telecom circuit   
File Size223KB,9 Pages
ManufacturerQorvo
Websitehttps://www.qorvo.com
Download Datasheet Parametric View All

D2525P30 Overview

Support Circuit, 1-Func, HEAT SINK, HERMETIC SEALED, BUTTERFLY PACKAGE-14

D2525P30 Parametric

Parameter NameAttribute value
MakerQorvo
Parts packaging codeCUSTOM
package instruction,
Contacts14
Reach Compliance Codeunknown
JESD-30 codeR-XDFO-F14
Number of functions1
Number of terminals14
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFIBER OPTIC
Certification statusNot Qualified
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Terminal formFLAT
Terminal locationDUAL
Base Number Matches1

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