IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP40, SIDE BRAZED, CERAMIC, DIP-40, Analog to Digital Converter
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | SIDE BRAZED, CERAMIC, DIP-40 |
| Contacts | 40 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum analog input voltage | 4.3 V |
| Minimum analog input voltage | -4.3 V |
| Maximum conversion time | 0.005 µs |
| Converter type | ADC, FLASH METHOD |
| JESD-30 code | R-CDIP-T40 |
| JESD-609 code | e0 |
| Maximum linear error (EL) | 0.75% |
| Nominal negative supply voltage | -5.2 V |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output bit code | BINARY |
| Output format | PARALLEL, 8 BITS |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5,-5.2 V |
| Certification status | Not Qualified |
| Sampling rate | 200 MHz |
| Maximum seat height | 5.72 mm |
| Maximum slew rate | 269 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |
| AD770KD | AD770SD | AD770JD | |
|---|---|---|---|
| Description | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP40, SIDE BRAZED, CERAMIC, DIP-40, Analog to Digital Converter | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP40, SIDE BRAZED, CERAMIC, DIP-40, Analog to Digital Converter | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP40, SIDE BRAZED, CERAMIC, DIP-40, Analog to Digital Converter |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP |
| package instruction | SIDE BRAZED, CERAMIC, DIP-40 | SIDE BRAZED, CERAMIC, DIP-40 | SIDE BRAZED, CERAMIC, DIP-40 |
| Contacts | 40 | 40 | 40 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant |
| ECCN code | EAR99 | 3A001.A.2.C | EAR99 |
| Maximum analog input voltage | 4.3 V | 4.3 V | 4.3 V |
| Minimum analog input voltage | -4.3 V | -4.3 V | -4.3 V |
| Maximum conversion time | 0.005 µs | 0.005 µs | 0.005 µs |
| Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 code | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 |
| JESD-609 code | e0 | e0 | e0 |
| Maximum linear error (EL) | 0.75% | 0.9% | 0.9% |
| Nominal negative supply voltage | -5.2 V | -5.2 V | -5.2 V |
| Number of digits | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 40 | 40 | 40 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C |
| Output bit code | BINARY | BINARY | BINARY |
| Output format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Sampling rate | 200 MHz | 200 MHz | 200 MHz |
| Maximum seat height | 5.72 mm | 5.72 mm | 5.72 mm |
| Maximum slew rate | 269 mA | 269 mA | 269 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 15.24 mm |
| Base Number Matches | 1 | 1 | 1 |
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