|
MP7545BKP |
MP7545BLN |
Description |
D/A Converter, 1 Func, Parallel, Word Input Loading, 1us Settling Time, PQCC20, PLASTIC, LCC-20 |
D/A Converter, 1 Func, Parallel, Word Input Loading, 1us Settling Time, PDIP20, 0.300 INCH, PLASTIC, DIP-20 |
Is it Rohs certified? |
incompatible |
incompatible |
Parts packaging code |
QLCC |
DIP |
package instruction |
QCCJ, LDCC20,.4SQ |
DIP, DIP20,.3 |
Contacts |
20 |
20 |
Reach Compliance Code |
unknown |
unknown |
Maximum analog output voltage |
10 V |
10 V |
Minimum analog output voltage |
-10 V |
-10 V |
Converter type |
D/A CONVERTER |
D/A CONVERTER |
Enter bit code |
BINARY |
BINARY |
Input format |
PARALLEL, WORD |
PARALLEL, WORD |
JESD-30 code |
S-PQCC-J20 |
R-PDIP-T20 |
JESD-609 code |
e0 |
e0 |
length |
8.965 mm |
25.21 mm |
Maximum linear error (EL) |
0.0244% |
0.0122% |
Number of digits |
12 |
12 |
Number of functions |
1 |
1 |
Number of terminals |
20 |
20 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
QCCJ |
DIP |
Encapsulate equivalent code |
LDCC20,.4SQ |
DIP20,.3 |
Package shape |
SQUARE |
RECTANGULAR |
Package form |
CHIP CARRIER |
IN-LINE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
5/15 V |
5/15 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
4.57 mm |
5.33 mm |
Maximum stabilization time |
1 µs |
1 µs |
Nominal settling time (tstl) |
1 µs |
1 µs |
Maximum slew rate |
1 mA |
1 mA |
Nominal supply voltage |
5 V |
5 V |
surface mount |
YES |
NO |
technology |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
J BEND |
THROUGH-HOLE |
Terminal pitch |
1.27 mm |
2.54 mm |
Terminal location |
QUAD |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
8.965 mm |
7.62 mm |