Flash, 128KX8, 150ns, PQCC32, PLASTIC, LCC-32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | QFJ |
package instruction | QCCJ, LDCC32,.5X.6 |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 150 ns |
Other features | BULK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE |
command user interface | NO |
Data polling | NO |
JESD-30 code | R-PQCC-J32 |
JESD-609 code | e0 |
length | 13.97 mm |
memory density | 1048576 bit |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Programming voltage | 12 V |
Certification status | Not Qualified |
Maximum seat height | 3.56 mm |
Maximum standby current | 0.00002 A |
Maximum slew rate | 0.05 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | NO |
type | NOR TYPE |
width | 11.43 mm |
Base Number Matches | 1 |
HN28F101CP-15 | HN28F101FP-20 | HN28F101R-12 | |
---|---|---|---|
Description | Flash, 128KX8, 150ns, PQCC32, PLASTIC, LCC-32 | Flash, 128KX8, 200ns, PDSO32, PLASTIC, SOP-32 | Flash, 128KX8, 120ns, PDSO32, PLASTIC, TSOP-32 |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Parts packaging code | QFJ | SOIC | TSOP |
package instruction | QCCJ, LDCC32,.5X.6 | SOP, SOP32,.56 | TSOP1-R, TSSOP32,.56,20 |
Contacts | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 |
Maximum access time | 150 ns | 200 ns | 120 ns |
command user interface | NO | NO | NO |
Data polling | NO | NO | NO |
JESD-30 code | R-PQCC-J32 | R-PDSO-G32 | R-PDSO-G32 |
JESD-609 code | e0 | e0 | e0 |
length | 13.97 mm | 20.45 mm | 12.4 mm |
memory density | 1048576 bit | 1048576 bit | 1048576 bit |
Memory IC Type | FLASH | FLASH | FLASH |
memory width | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 |
word count | 131072 words | 131072 words | 131072 words |
character code | 128000 | 128000 | 128000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 128KX8 | 128KX8 | 128KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | SOP | TSOP1-R |
Encapsulate equivalent code | LDCC32,.5X.6 | SOP32,.56 | TSSOP32,.56,20 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V |
Programming voltage | 12 V | 12 V | 12 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.56 mm | 3 mm | 1.2 mm |
Maximum standby current | 0.00002 A | 0.00002 A | 0.00002 A |
Maximum slew rate | 0.05 mA | 0.05 mA | 0.05 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 0.5 mm |
Terminal location | QUAD | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
switch bit | NO | NO | NO |
type | NOR TYPE | NOR TYPE | NOR TYPE |
width | 11.43 mm | 11.3 mm | 8 mm |
Base Number Matches | 1 | 1 | - |
Maker | - | Hitachi (Renesas ) | Hitachi (Renesas ) |