M24C64-FMN6GB datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> M24C64-FMN6GB

M24C64-FMN6GB: Description8KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8; Categorystorage storage; File Size269KB，34 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

Download Datasheet Parametric View All

M24C64-FMN6GB Overview

8KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

M24C64-FMN6GB Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	SOIC
package instruction	0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
Contacts	8
Reach Compliance Code	compliant
Maximum clock frequency (fCLK)	0.4 MHz
JESD-30 code	R-PDSO-G8
JESD-609 code	e4
length	4.9 mm
memory density	65536 bit
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	8192 words
character code	8000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.75 mm
Serial bus type	I2C
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	3.9 mm
Maximum write cycle time (tWC)	10 ms
Base Number Matches	1

Preview

Download Datasheet

View All

M24C64-W M24C64-R M24C64-F

M24C32-W M24C32-R M24C32-F

64 Kbit and 32 Kbit Serial I²C bus EEPROM

Feature summary

■

Two-Wire I

C serial interface

Supports 400kHz Protocol

Single supply voltage:

– 2.5 to 5.5V for M24Cxx-W

– 1.8 to 5.5V for M24Cxx-R

– 1.7 to 5.5V for M25Cxx-F

Write Control Input

Byte and Page Write (up to 32 Bytes)

Random And Sequential Read modes

Self-Timed programming cycle

Automatic address incrementing

Enhanced ESD/Latch-Up Protection

More than 1 Million Write cycles

More than 40-year data retention

SO8 (MN)

150 mil width

■

PDIP8 (BN)

■

TSSOP8 (DW)

169 mil width

UFDFPN8 (MB)

2x3mm² (MLP)

July 2006

Rev 8

1/34

www.st.com

Contents

M24Cxx-W, M24Cxx-R, M24Cxx-F

Contents

Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.0.1

2.0.2

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.3.1

2.3.2

2.3.3

Operating supply voltage V

CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Internal device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

4.10

4.11

4.12

4.13

4.14

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 17

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2/34

Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

List of tables

M24Cxx-W, M24Cxx-R, M24Cxx-F

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Address Most Significant Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Address Least Significant Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Operating conditions (M24Cxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Operating conditions (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Operating conditions (M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

DC characteristics (M24Cxx-W6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

DC characteristics (M24Cxx-W3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC characteristics (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC characteristics (M24C32-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

AC characteristics (M24Cxx-W6 and M24Cxx-W3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

AC characteristics (M24Cxx-R, M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, package mechanical data . . . . . . . . . . . . 27

SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

TSSOP8 – 8 lead Thin Shrink Small Outline, package mechanical data . . . . . . . . . . . . . . 29

UFDFPN8 (MLP8) – 8-lead Ultra thin Fine pitch Dual Flat Package No lead

2 × 3mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

4/34

M24Cxx-W, M24Cxx-R, M24Cxx-F

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

DIP, SO, TSSOP and UFDFPN connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Maximum RP value versus bus parasitic capacitance (C) for an I2C bus . . . . . . . . . . . . . . 9

C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 14

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 16

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, package outline . . . . . . . . . . . . . . . . . . . . 27

SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, package outline . . . . . . 28

TSSOP8 – 8 lead Thin Shrink Small Outline, package outline . . . . . . . . . . . . . . . . . . . . . . 29

UFDFPN8 (MLP8) – 8-lead Ultra thin Fine pitch Dual Flat Package No lead

2 × 3mm, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

5/34

Recommended Resources

Operational amplifier stabilized power supply circuit 4

Multifunctional thermostatic control circuit

AD590 integrated temperature sensor typical application circuit

Constant current source circuit diagram with different output currents

Electronic fire regulator circuit diagram

Monostable multivibrator circuit diagram

Xunwei IMX6 development board Android application-buzzer test: The supporting materials for this chapter are in the directory of "iTOP-i.MX6 development board data summary (excluding CD data)\06_iTOP-iMX6 development board Android application development environm...; 遥寄山川 ARM Technology

Lithium-ion battery: [size=4]When it comes to lithium-ion batteries, we should think of several parts: [/size][size=4]battery cells, fuel gauge, battery protection board, and battery charging circuit. [/size] [size=4] [/s...; qwqwqw2088 Analogue and Mixed Signal

How to expand the BIM code space of CC2640 SDK sample code: Usually in the process of implementing the OAD (on-air-download) function, TI will provide a standard sample BIM (Boot Image Manager) code for image verification and downloading. In the sample code pr...; Jacktang Wireless Connectivity

Sound Level Meter MASTECH MS6700 Disassembly Pictures and Information: Product informationDisassembly picture:Device Analysis:Data Sheet:...; littleshrimp Integrated technical exchanges

Design of Multi-channel Data Acquisition System Based on CPLD: [size=4] The data acquisition system has strong versatility and can be widely used in military, industrial production, scientific research and daily life. With the popularization of computers, the app...; Jacktang DSP and ARM Processors

EEWORLD University Hall----Underactuated Robotics MIT 2019 spring 6.382: Underactuated Robotics MIT 2019 spring 6.382：https://training.eeworld.com.cn/course/5371Robots today move far too conservatively, using control systems that attempt to maintain full control authority ...; 老白菜 Integrated technical exchanges

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components