|
2SK1329 |
2SK1301 |
2SK1328 |
2SK1934 |
2SK1301-E |
GRM219R61A225KA01J |
S6272 |
2SK1934-E |
Description |
Silicon N Channel MOS FET |
Silicon N Channel MOS FET |
Silicon N Channel MOS FET |
Silicon N Channel MOS FET |
Silicon N Channel MOS FET |
Chip Multilayer Ceramic Capacitors for General Purpose |
18 watt; Mini Spiral Compact Fluorescent; 4100K; 82 CRI; Medium base; 120 volts; 3-pack |
Silicon N Channel MOS FET |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Lead free |
- |
- |
Lead free |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
conform to |
- |
- |
conform to |
Parts packaging code |
TO-3PFM |
TO-220AB |
TO-3PFM |
TO-3P |
TO-220AB |
- |
- |
TO-3P |
package instruction |
FLANGE MOUNT, R-PSFM-T3 |
FLANGE MOUNT, R-PSFM-T3 |
FLANGE MOUNT, R-PSFM-T3 |
FLANGE MOUNT, R-PSFM-T3 |
FLANGE MOUNT, R-PSFM-T3 |
- |
- |
SC-65, TO-3P, 3 PIN |
Contacts |
3 |
3 |
3 |
3 |
3 |
- |
- |
4 |
Reach Compliance Code |
compliant |
compli |
compliant |
unknow |
compli |
- |
- |
compli |
Shell connection |
ISOLATED |
DRAIN |
ISOLATED |
DRAIN |
DRAIN |
- |
- |
DRAIN |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
- |
- |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
500 V |
100 V |
450 V |
1000 V |
100 V |
- |
- |
1000 V |
Maximum drain current (Abs) (ID) |
12 A |
15 A |
12 A |
8 A |
15 A |
- |
- |
8 A |
Maximum drain current (ID) |
12 A |
15 A |
12 A |
8 A |
15 A |
- |
- |
8 A |
Maximum drain-source on-resistance |
0.6 Ω |
0.18 Ω |
0.55 Ω |
1.6 Ω |
0.18 Ω |
- |
- |
1.6 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
- |
- |
METAL-OXIDE SEMICONDUCTOR |
JESD-30 code |
R-PSFM-T3 |
R-PSFM-T3 |
R-PSFM-T3 |
R-PSFM-T3 |
R-PSFM-T3 |
- |
- |
R-PSFM-T3 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e2 |
- |
- |
e2 |
Number of components |
1 |
1 |
1 |
1 |
1 |
- |
- |
1 |
Number of terminals |
3 |
3 |
3 |
3 |
3 |
- |
- |
3 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
- |
- |
ENHANCEMENT MODE |
Maximum operating temperature |
150 °C |
150 °C |
150 °C |
150 °C |
150 °C |
- |
- |
150 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
- |
PLASTIC/EPOXY |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
- |
RECTANGULAR |
Package form |
FLANGE MOUNT |
FLANGE MOUNT |
FLANGE MOUNT |
FLANGE MOUNT |
FLANGE MOUNT |
- |
- |
FLANGE MOUNT |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
- |
NOT SPECIFIED |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
- |
- |
N-CHANNEL |
Maximum power dissipation(Abs) |
60 W |
50 W |
60 W |
150 W |
50 W |
- |
- |
150 W |
Maximum pulsed drain current (IDM) |
48 A |
60 A |
48 A |
24 A |
60 A |
- |
- |
24 A |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
- |
Not Qualified |
surface mount |
NO |
NO |
NO |
NO |
NO |
- |
- |
NO |
Terminal surface |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN COPPER |
- |
- |
Tin/Copper (Sn/Cu) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
- |
- |
THROUGH-HOLE |
Terminal location |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
- |
- |
SINGLE |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
- |
NOT SPECIFIED |
transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
- |
- |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |
- |
- |
SILICON |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
- |
- |
1 |