EEPROM, 8KX8, 250ns, Parallel, CMOS, PQCC32, LEAD AND HALOGEN FREE, PLASTIC, LCC-32
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Parts packaging code | QFJ |
package instruction | QCCJ, LDCC32,.5X.6 |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 250 ns |
command user interface | NO |
Data polling | YES |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | R-PQCC-J32 |
JESD-609 code | e3 |
length | 13.97 mm |
memory density | 65536 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
organize | 8KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
page size | 32 words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 3.55 mm |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.008 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 40 |
switch bit | YES |
width | 11.43 mm |
Maximum write cycle time (tWC) | 5 ms |
Base Number Matches | 1 |