|
TC5316200CP |
TC5316200CF |
TC5316200CFT |
Description |
IC 2M X 8 MASK PROM, 120 ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42, Programmable ROM |
IC 2M X 8 MASK PROM, 120 ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44, Programmable ROM |
IC 2M X 8 MASK PROM, 120 ns, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44, Programmable ROM |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
Parts packaging code |
DIP |
SOIC |
TSOP2 |
package instruction |
0.600 INCH, PLASTIC, DIP-42 |
0.600 INCH, PLASTIC, SOP-44 |
0.400 INCH, PLASTIC, TSOP2-44 |
Contacts |
42 |
44 |
44 |
Reach Compliance Code |
unknown |
unknown |
unknown |
Maximum access time |
120 ns |
120 ns |
120 ns |
JESD-30 code |
R-PDIP-T42 |
R-PDSO-G44 |
R-PDSO-G44 |
JESD-609 code |
e0 |
e0 |
e0 |
length |
53.2 mm |
28.2 mm |
18.41 mm |
memory density |
16777216 bit |
16777216 bit |
16777216 bit |
Memory IC Type |
MASK ROM |
MASK ROM |
MASK ROM |
memory width |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
Number of terminals |
42 |
44 |
44 |
word count |
2097152 words |
2097152 words |
2097152 words |
character code |
2000000 |
2000000 |
2000000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
organize |
2MX8 |
2MX8 |
2MX8 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
SOP |
TSOP2 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
240 |
240 |
240 |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
4.8 mm |
3.1 mm |
1.2 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
surface mount |
NO |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
TIN LEAD |
TIN LEAD |
TIN LEAD |
Terminal form |
THROUGH-HOLE |
GULL WING |
GULL WING |
Terminal pitch |
2.54 mm |
1.27 mm |
0.8 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
15.24 mm |
12.6 mm |
10.16 mm |
Maker |
- |
Toshiba Semiconductor |
Toshiba Semiconductor |