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HY27UF162G2M-UPES

Description
Flash, 128MX16, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, ULGA-52
Categorystorage    storage   
File Size449KB,53 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Environmental Compliance  
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HY27UF162G2M-UPES Overview

Flash, 128MX16, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, ULGA-52

HY27UF162G2M-UPES Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeLGA
package instructionVFLGA, LGA52(UNSPEC)
Contacts52
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time30 ns
Other featuresCONTAINS ADDITIONAL 256M BIT SPARE MEMORY
command user interfaceYES
Data pollingNO
JESD-30 codeR-PBGA-B52
length17 mm
memory density2147483648 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size2K
Number of terminals52
word count134217728 words
character code128000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize128MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFLGA
Encapsulate equivalent codeLGA52(UNSPEC)
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
page size1K words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3/3.3 V
Programming voltage3.3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height0.65 mm
Department size64K
Maximum standby current0.00005 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBUTT
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
switch bitNO
typeNAND TYPE
width12 mm
Base Number Matches1

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