Flash, 128MX16, 30ns, PBGA52, 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, ULGA-52
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | LGA |
package instruction | VFLGA, LGA52(UNSPEC) |
Contacts | 52 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 30 ns |
Other features | CONTAINS ADDITIONAL 256M BIT SPARE MEMORY |
command user interface | YES |
Data polling | NO |
JESD-30 code | R-PBGA-B52 |
length | 17 mm |
memory density | 2147483648 bit |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of departments/size | 2K |
Number of terminals | 52 |
word count | 134217728 words |
character code | 128000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
organize | 128MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFLGA |
Encapsulate equivalent code | LGA52(UNSPEC) |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
page size | 1K words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/3.3 V |
Programming voltage | 3.3 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 0.65 mm |
Department size | 64K |
Maximum standby current | 0.00005 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal form | BUTT |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 20 |
switch bit | NO |
type | NAND TYPE |
width | 12 mm |
Base Number Matches | 1 |