32-BIT, 8MHz, MICROPROCESSOR, PQCC68, 25.57 X 25.27 MM, 1.27 MM PITCH, PLASTIC, LCC-68
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | LCC |
package instruction | QCCJ, LDCC68,1.0SQ |
Contacts | 68 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Other features | ALSO OPERATES AT 3.3 V |
Address bus width | 24 |
bit size | 32 |
boundary scan | NO |
maximum clock frequency | 8 MHz |
External data bus width | 16 |
Format | FIXED POINT |
Integrated cache | NO |
JESD-30 code | R-PQCC-J68 |
JESD-609 code | e0 |
length | 24.2062 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 68 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC68,1.0SQ |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | 220 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.57 mm |
speed | 8 MHz |
Maximum slew rate | 25 mA |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 4.75 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | HCMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 24.2062 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
Base Number Matches | 1 |