IC,BUFFER/DRIVER,DUAL,4-BIT,AS-TTL,DIP,20PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP20,.3 |
Reach Compliance Code | unknown |
Control type | ENABLE LOW |
JESD-30 code | R-XDIP-T20 |
JESD-609 code | e0 |
Logic integrated circuit type | BUS DRIVER |
MaximumI(ol) | 0.064 A |
Number of digits | 4 |
Number of functions | 2 |
Number of terminals | 20 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output characteristics | 3-STATE |
Output polarity | TRUE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Maximum supply current (ICC) | 90 mA |
Prop。Delay @ Nom-Sup | 6.2 ns |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
DM74AS244J | DM74AS244N/B+ | DM74AS240J | DM74AS240N/B+ | |
---|---|---|---|---|
Description | IC,BUFFER/DRIVER,DUAL,4-BIT,AS-TTL,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,AS-TTL,DIP,20PIN,PLASTIC | IC,BUFFER/DRIVER,DUAL,4-BIT,AS-TTL,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,AS-TTL,DIP,20PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
JESD-30 code | R-XDIP-T20 | R-PDIP-T20 | R-XDIP-T20 | R-PDIP-T20 |
JESD-609 code | e0 | e0 | e0 | e0 |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
MaximumI(ol) | 0.064 A | 0.064 A | 0.064 A | 0.064 A |
Number of digits | 4 | 4 | 4 | 4 |
Number of functions | 2 | 2 | 2 | 2 |
Number of terminals | 20 | 20 | 20 | 20 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Output polarity | TRUE | TRUE | INVERTED | INVERTED |
Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V |
Maximum supply current (ICC) | 90 mA | 90 mA | 75 mA | 75 mA |
Prop。Delay @ Nom-Sup | 6.2 ns | 6.2 ns | 6.5 ns | 6.5 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO |
technology | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | - |