Standard SRAM, 1MX18, 3.4ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | QFP |
package instruction | LQFP, |
Contacts | 100 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 3.4 ns |
Other features | PIPELINED ARCHITECTURE |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e0 |
length | 20 mm |
memory density | 18874368 bit |
Memory IC Type | STANDARD SRAM |
memory width | 18 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX18 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Package shape | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |
Base Number Matches | 1 |
AS7C331MPFD18A-166TQC | AS7C331MPFD18A-166TQCN | AS7C331MPFD18A-133TQI | AS7C331MPFD18A-133TQIN | AS7C331MPFD18A-133TQC | AS7C331MPFD18A-166TQI | AS7C331MPFD18A-166TQIN | AS7C331MPFD18A-133TQCN | |
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Description | Standard SRAM, 1MX18, 3.4ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Standard SRAM, 1MX18, 3.4ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | Standard SRAM, 1MX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Standard SRAM, 1MX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | Standard SRAM, 1MX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Standard SRAM, 1MX18, 3.4ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Standard SRAM, 1MX18, 3.4ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | Standard SRAM, 1MX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 |
Is it lead-free? | Contains lead | Lead free | Contains lead | Lead free | Contains lead | Contains lead | Lead free | Lead free |
Is it Rohs certified? | incompatible | conform to | incompatible | conform to | incompatible | incompatible | conform to | conform to |
Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
package instruction | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, |
Contacts | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 3.4 ns | 3.4 ns | 3.8 ns | 3.8 ns | 3.8 ns | 3.4 ns | 3.4 ns | 3.8 ns |
Other features | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609 code | e0 | e3 | e0 | e3 | e0 | e0 | e3 | e3 |
length | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
memory density | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C |
organize | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 245 | NOT SPECIFIED | 245 | NOT SPECIFIED | NOT SPECIFIED | 245 | 245 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
Maximum supply voltage (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
Terminal surface | TIN LEAD | MATTE TIN | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD | MATTE TIN | MATTE TIN |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 |
width | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |