ADC Subsystem, 16-Bit, 1 Func, 8 Channel, Parallel, Word Access, Bipolar, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | HERMETIC SEALED, CERAMIC, DIP-32 |
Reach Compliance Code | unknown |
Maximum analog input voltage | 10 V |
Minimum analog input voltage | -10 V |
Maximum conversion time | 25 µs |
Converter type | ADC SUBSYSTEM |
JESD-30 code | R-CDIP-T32 |
JESD-609 code | e0 |
Maximum linear error (EL) | 0.006% |
Nominal negative supply voltage | -15 V |
Number of analog input channels | 8 |
Number of digits | 16 |
Number of functions | 1 |
Number of terminals | 32 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output bit code | BINARY, OFFSET BINARY |
Output format | PARALLEL, WORD |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP32,.9 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5,+-15 V |
Certification status | Not Qualified |
Sampling rate | 0.025 MHz |
Sample and hold/Track and hold | SAMPLE |
Filter level | 38535Q/M;38534H;883B |
Maximum seat height | 5.79 mm |
Nominal supply voltage | 15 V |
surface mount | NO |
technology | BIPOLAR |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 22.86 mm |
Base Number Matches | 1 |
SP9480S/B | SP9480T/B | SP9480J | SP9480K | |
---|---|---|---|---|
Description | ADC Subsystem, 16-Bit, 1 Func, 8 Channel, Parallel, Word Access, Bipolar, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32 | ADC Subsystem, 16-Bit, 1 Func, 8 Channel, Parallel, Word Access, Bipolar, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32 | ADC Subsystem, 16-Bit, 1 Func, 8 Channel, Parallel, Word Access, Bipolar, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32 | ADC Subsystem, 16-Bit, 1 Func, 8 Channel, Parallel, Word Access, Bipolar, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
package instruction | HERMETIC SEALED, CERAMIC, DIP-32 | HERMETIC SEALED, CERAMIC, DIP-32 | HERMETIC SEALED, CERAMIC, DIP-32 | HERMETIC SEALED, CERAMIC, DIP-32 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Maximum analog input voltage | 10 V | 10 V | 10 V | 10 V |
Minimum analog input voltage | -10 V | -10 V | -10 V | -10 V |
Maximum conversion time | 25 µs | 25 µs | 25 µs | 25 µs |
Converter type | ADC SUBSYSTEM | ADC SUBSYSTEM | ADC SUBSYSTEM | ADC SUBSYSTEM |
JESD-30 code | R-CDIP-T32 | R-CDIP-T32 | R-CDIP-T32 | R-CDIP-T32 |
JESD-609 code | e0 | e0 | e0 | e0 |
Maximum linear error (EL) | 0.006% | 0.006% | 0.006% | 0.006% |
Nominal negative supply voltage | -15 V | -15 V | -15 V | -15 V |
Number of analog input channels | 8 | 8 | 8 | 8 |
Number of digits | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 | 32 |
Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C |
Output bit code | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
Output format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP32,.9 | DIP32,.9 | DIP32,.9 | DIP32,.9 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Sampling rate | 0.025 MHz | 0.025 MHz | 0.025 MHz | 0.025 MHz |
Sample and hold/Track and hold | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
Maximum seat height | 5.79 mm | 5.79 mm | 5.79 mm | 5.79 mm |
Nominal supply voltage | 15 V | 15 V | 15 V | 15 V |
surface mount | NO | NO | NO | NO |
technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
width | 22.86 mm | 22.86 mm | 22.86 mm | 22.86 mm |
Maker | - | SIPEX | SIPEX | SIPEX |