F-210-1
HDWM–30–53–L–D–355–SM
HDWM–20–59–G–S–535–SM
HDWM–16–57–G–D–280–SM
(1,27mm) .050"
HDWM SERIES
SMT MICRO BOARD STACKER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?HDWM
Insulator Material:
Top: Black LCP
Bottom: Natural LCP
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ"
(1,27µm) Ni
Current Rating:
1A
Operating Temp Range:
-55°C to + 105°C with Tin
-55°C to + 125°C with Gold
RoHS Compliant:
Yes
Mates with:
SMS, SLM, RSM
B o a rd
S t a ck i n g
SO C KE T
PR O FI LE
PO ST
BO A RD
SP A C E
O V ER A LL
PI N
(O A L)
ST A C KE R
HE IG H T
(2,54mm) .100"
Alignment pin
or locking clip
option available
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
.006" (0,15mm) max
(1,27mm)
.050" pitch
HDWM
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
ROW
OPTION
STACKER
HEIGHT
SM
OTHER
OPTION
–L
= 10µ"
(0,25µm)
Gold on
post,
Matte Tin
on tail
–S
= Single
Row
–“XXX”
= Stacker
Height
Example:
–250 =
(6,35mm)
.250"
02 thru 40
–“XXX”
= Polarized
= Alignment Pin
(6 positions minimum
–D only.)
Metal or plastic at
Samtec’s discretion
(N/A with –LC)
–D
= Double
Row
–A
50
(1,27) .050 x
No. of Positions
–G
= 10µ"
(2,48)
(0,25µm)
.098
Gold
on post,
01
Gold flash
on tail
100
(5,01)
.198
(1,27) .050 TYP
(7,52) .296
02
(2,54)
.100
01
99
(4,98)
.196
(0,46)
.018
SQ
(0,00)
.000
MIN
(2,54)
.100
(0,51)
.020
(0,51)
.020
DIA
LEAD
STYLE
–01
–53
–54
–55
–56
–57
–58
–59
OAL
(8,38) .330
(9,78) .385
(11,05) .435
(12,45) .490
(12,83) .505
(13,46) .530
(14,86) .585
(15,62) .615
= Locking Clip
(5 positions minimum.
–D only)
(N/A with –A)
(Manual placement
required)
–LC
= Pick & Place Pad
–P
(1,27)
.050
TYP
Note:
Other Gold plating
options available.
Contact Samtec.
Note:
This Series is
non-standard, non-returnable.
STACKER
HEIGHT
(6,35)
.250
(1,27)
MIN
.050
OAL
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