MT55V512V32PF-10 datasheet, PDF

MT55V512V32PF-10: DescriptionZBT SRAM, 512KX32, 5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165; Categorystorage storage; File Size787KB，37 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT55V512V32PF-10 Overview

ZBT SRAM, 512KX32, 5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	13 X 15 MM, FBGA-165
Contacts	165
Reach Compliance Code	not_compliant
ECCN code	3A991.B.2.A
Maximum access time	5 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B165
JESD-609 code	e0
length	15 mm
memory density	16777216 bit
Memory IC Type	ZBT SRAM
memory width	32
Number of functions	1
Number of terminals	165
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL
power supply	2.5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.03 A
Minimum standby current	2.38 V
Maximum slew rate	0.2 mA
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	13 mm
Base Number Matches	1

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