IC,LOGIC MUX,DUAL,4-INPUT,STD-TTL,FP,16PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Reach Compliance Code | compliant |
JESD-30 code | R-XDFP-F16 |
JESD-609 code | e0 |
Logic integrated circuit type | MULTIPLEXER |
MaximumI(ol) | 0.016 A |
Number of functions | 2 |
Number of entries | 4 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DFP |
Encapsulate equivalent code | FL16,.3 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Maximum supply current (ICC) | 56 mA |
Prop。Delay @ Nom-Sup | 34 ns |
Certification status | Not Qualified |
surface mount | YES |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
DM7214W | DM7219F | DM7214J | DM7214J/883 | |
---|---|---|---|---|
Description | IC,LOGIC MUX,DUAL,4-INPUT,STD-TTL,FP,16PIN,CERAMIC | IC,LOGIC MUX,SINGLE,16-INPUT,STD-TTL,FP,24PIN,CERAMIC | IC,LOGIC MUX,DUAL,4-INPUT,STD-TTL,DIP,16PIN,CERAMIC | IC 72 SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, DIP16, DIP-16, Multiplexer/Demultiplexer |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | compliant | compliant | compliant | unknown |
JESD-30 code | R-XDFP-F16 | R-XDFP-F24 | R-XDIP-T16 | R-XDIP-T16 |
JESD-609 code | e0 | e0 | e0 | e0 |
Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
MaximumI(ol) | 0.016 A | 0.016 A | 0.016 A | 0.016 A |
Number of functions | 2 | 1 | 2 | 2 |
Number of entries | 4 | 16 | 4 | 4 |
Number of terminals | 16 | 24 | 16 | 16 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | CERAMIC | CERAMIC | UNSPECIFIED |
encapsulated code | DFP | DFP | DIP | DIP |
Encapsulate equivalent code | FL16,.3 | FL24,.4 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
Maximum supply current (ICC) | 56 mA | 68 mA | 56 mA | 56 mA |
Prop。Delay @ Nom-Sup | 34 ns | 35 ns | 34 ns | 34 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | YES | NO | NO |
technology | TTL | TTL | TTL | TTL |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 |