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DM7219F

Description
IC,LOGIC MUX,SINGLE,16-INPUT,STD-TTL,FP,24PIN,CERAMIC
Categorylogic   
File Size119KB,4 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

DM7219F Overview

IC,LOGIC MUX,SINGLE,16-INPUT,STD-TTL,FP,24PIN,CERAMIC

DM7219F Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Reach Compliance Codecompliant
Is SamacsysN
JESD-30 codeR-XDFP-F24
JESD-609 codee0
Logic integrated circuit typeMULTIPLEXER
MaximumI(ol)0.016 A
Number of functions1
Number of entries16
Number of terminals24
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL24,.4
Package shapeRECTANGULAR
Package formFLATPACK
Maximum supply current (ICC)68 mA
Prop。Delay @ Nom-Sup35 ns
Certification statusNot Qualified
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1

DM7219F Related Products

DM7219F DM7214J DM7214W DM7214J/883
Description IC,LOGIC MUX,SINGLE,16-INPUT,STD-TTL,FP,24PIN,CERAMIC IC,LOGIC MUX,DUAL,4-INPUT,STD-TTL,DIP,16PIN,CERAMIC IC,LOGIC MUX,DUAL,4-INPUT,STD-TTL,FP,16PIN,CERAMIC IC 72 SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, DIP16, DIP-16, Multiplexer/Demultiplexer
Is it Rohs certified? incompatible incompatible incompatible incompatible
Reach Compliance Code compliant compliant compliant unknown
JESD-30 code R-XDFP-F24 R-XDIP-T16 R-XDFP-F16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0
Logic integrated circuit type MULTIPLEXER MULTIPLEXER MULTIPLEXER MULTIPLEXER
MaximumI(ol) 0.016 A 0.016 A 0.016 A 0.016 A
Number of functions 1 2 2 2
Number of entries 16 4 4 4
Number of terminals 24 16 16 16
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC UNSPECIFIED
encapsulated code DFP DIP DFP DIP
Encapsulate equivalent code FL24,.4 DIP16,.3 FL16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE FLATPACK IN-LINE
Maximum supply current (ICC) 68 mA 56 mA 56 mA 56 mA
Prop。Delay @ Nom-Sup 35 ns 34 ns 34 ns 34 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES NO YES NO
technology TTL TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE FLAT THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1
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