Basic information of CLC115AMC amplifier:
CLC115AMC is a BUFFER. Commonly used packaging methods are DIE, DIE OR CHIP
CLC115AMC amplifier core information:
The minimum operating temperature of the CLC115AMC is -55 °C and the maximum operating temperature is 125 °C. Maximum bias current at 25°C: 20 µA Maximum average bias current is 20 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the CLC115AMC has a nominal slew rate of 2700 V/us. The maximum slew rate of the CLC115AMC given by the manufacturer is 61 mA, while the minimum slew rate is 2200 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the CLC115AMC gain becomes 0.707 times the low-frequency gain is 700 MHz.
The nominal supply voltage of the CLC115AMC is 5 V, and its corresponding nominal negative supply voltage is -5 V. The input offset voltage of the CLC115AMC is 17000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of CLC115AMC:
CLC115AMC has 10 terminals. Its terminal position type is: UPPER.
CLC115AMC amplifier additional information:
Its temperature grade is: MILITARY. The corresponding JESD-30 code is: X-XUUC-N10. The package code of CLC115AMC is: DIE. The materials used in the CLC115AMC package are mostly UNSPECIFIED. And its package shape is UNSPECIFIED.
The CLC115AMC package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.
Basic information of CLC115AMC amplifier:
CLC115AMC is a BUFFER. Commonly used packaging methods are DIE, DIE OR CHIP
CLC115AMC amplifier core information:
The minimum operating temperature of the CLC115AMC is -55 °C and the maximum operating temperature is 125 °C. Maximum bias current at 25°C: 20 µA Maximum average bias current is 20 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the CLC115AMC has a nominal slew rate of 2700 V/us. The maximum slew rate of the CLC115AMC given by the manufacturer is 61 mA, while the minimum slew rate is 2200 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the CLC115AMC gain becomes 0.707 times the low-frequency gain is 700 MHz.
The nominal supply voltage of the CLC115AMC is 5 V, and its corresponding nominal negative supply voltage is -5 V. The input offset voltage of the CLC115AMC is 17000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of CLC115AMC:
CLC115AMC has 10 terminals. Its terminal position type is: UPPER.
CLC115AMC amplifier additional information:
Its temperature grade is: MILITARY. The corresponding JESD-30 code is: X-XUUC-N10. The package code of CLC115AMC is: DIE. The materials used in the CLC115AMC package are mostly UNSPECIFIED. And its package shape is UNSPECIFIED.
The CLC115AMC package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.
| Parameter Name | Attribute value |
| package instruction | DIE, DIE OR CHIP |
| Reach Compliance Code | unknown |
| Amplifier type | BUFFER |
| Maximum average bias current (IIB) | 20 µA |
| Nominal bandwidth (3dB) | 700 MHz |
| Maximum bias current (IIB) at 25C | 20 µA |
| Maximum input offset voltage | 17000 µV |
| JESD-30 code | X-XUUC-N10 |
| Negative supply voltage upper limit | -7 V |
| Nominal Negative Supply Voltage (Vsup) | -5 V |
| Number of functions | 4 |
| Number of terminals | 10 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Encapsulate equivalent code | DIE OR CHIP |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| power supply | +-5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| minimum slew rate | 2200 V/us |
| Nominal slew rate | 2700 V/us |
| Maximum slew rate | 61 mA |
| Supply voltage upper limit | 7 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Base Number Matches | 1 |
| CLC115AMC | CLC115AJE | CLC115ALC | CLC115AJP | CLC115AID | CLC115A8D | |
|---|---|---|---|---|---|---|
| Description | Buffer Amplifier, 4 Func, BIPolar, | Buffer Amplifier, 4 Func, BIPolar, PDSO14, | Buffer Amplifier, 4 Func, BIPolar, | Buffer Amplifier, 4 Func, BIPolar, PDIP14, | Buffer Amplifier, 4 Func, BIPolar, CDIP14, | Buffer Amplifier, 4 Func, BIPolar, CDIP14, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Amplifier type | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| Maximum average bias current (IIB) | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA |
| Nominal bandwidth (3dB) | 700 MHz | 700 MHz | 700 MHz | 700 MHz | 700 MHz | 700 MHz |
| Maximum bias current (IIB) at 25C | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA |
| Maximum input offset voltage | 17000 µV | 17000 µV | 17000 µV | 17000 µV | 17000 µV | 17000 µV |
| JESD-30 code | X-XUUC-N10 | R-PDSO-G14 | X-XUUC-N10 | R-PDIP-T14 | R-CDIP-T14 | R-CDIP-T14 |
| Negative supply voltage upper limit | -7 V | -7 V | -7 V | -7 V | -7 V | -7 V |
| Nominal Negative Supply Voltage (Vsup) | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 10 | 14 | 10 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C |
| Minimum operating temperature | -55 °C | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C |
| Package body material | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIE | SOP | DIE | DIP | DIP | DIP |
| Encapsulate equivalent code | DIE OR CHIP | SOP14,.25 | DIE OR CHIP | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | UNSPECIFIED | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | SMALL OUTLINE | UNCASED CHIP | IN-LINE | IN-LINE | IN-LINE |
| power supply | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| minimum slew rate | 2200 V/us | 2200 V/us | 2200 V/us | 2200 V/us | 2200 V/us | 2200 V/us |
| Nominal slew rate | 2700 V/us | 2700 V/us | 2700 V/us | 2700 V/us | 2700 V/us | 2700 V/us |
| Maximum slew rate | 61 mA | 61 mA | 61 mA | 61 mA | 61 mA | 61 mA |
| Supply voltage upper limit | 7 V | 7 V | 7 V | 7 V | 7 V | 7 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
| Terminal form | NO LEAD | GULL WING | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | UPPER | DUAL | UPPER | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| package instruction | DIE, DIE OR CHIP | - | DIE, DIE OR CHIP | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Is it Rohs certified? | - | incompatible | - | incompatible | incompatible | incompatible |
| JESD-609 code | - | e0 | - | e0 | e0 | e0 |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Terminal surface | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal pitch | - | 1.27 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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