CXD2931GA-9 datasheet, PDF - EEWORLD Datasheet

CXD2931GA-9: Description1 chip GPS LSI; CategoryWireless rf/communication Telecom circuit; File Size250KB，27 Pages; ManufacturerSONY; Websitehttp://www.sony.co.jp; Environmental Compliance

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CXD2931GA-9 Overview

1 chip GPS LSI

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SONY
Parts packaging code	LGA
package instruction	LFBGA, LGA144,15X15,32
Contacts	144
Reach Compliance Code	unknow
JESD-30 code	S-PBGA-BU144
JESD-609 code	e4
length	13 mm
Number of functions	1
Number of terminals	144
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	LGA144,15X15,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Gold (Au)
Terminal form	BUTT
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	10
width	13 mm

	CXD2931GA-9	CXD2931R-9
Description	1 chip GPS LSI	1 chip GPS LSI
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Maker	SONY	SONY
Parts packaging code	LGA	QFP
package instruction	LFBGA, LGA144,15X15,32	LFQFP, QFP144,.87SQ,20
Contacts	144	144
Reach Compliance Code	unknow	unknow
JESD-30 code	S-PBGA-BU144	S-PQFP-G144
JESD-609 code	e4	e4
length	13 mm	20 mm
Number of functions	1	1
Number of terminals	144	144
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFQFP
Encapsulate equivalent code	LGA144,15X15,32	QFP144,.87SQ,20
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.4 mm	1.7 mm
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Gold (Au)	Palladium (Pd)
Terminal form	BUTT	GULL WING
Terminal pitch	0.8 mm	0.5 mm
Terminal location	BOTTOM	QUAD
Maximum time at peak reflow temperature	10	10
width	13 mm	20 mm

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