SL28DB200AZIT datasheet, PDF - EEWORLD Datasheet

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SL28DB200AZIT: DescriptionTelecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, MO-153AB, TSSOP-16; CategoryWireless rf/communication Telecom circuit; File Size118KB，8 Pages; ManufacturerSilicon Laboratories Inc; Environmental Compliance

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SL28DB200AZIT Overview

Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, MO-153AB, TSSOP-16

SL28DB200AZIT Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	TSSOP
package instruction	TSSOP,
Contacts	16
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G16
length	5 mm
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.2 mm
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	4.4 mm
Base Number Matches	1

SL28DB200AZIT Related Products

	SL28DB200AZIT	SL28DB200AZI	SL28DB200AZCT	SL28DB200AZC
Description	Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, MO-153AB, TSSOP-16	Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, MO-153AB, TSSOP-16	Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, MO-153AB, TSSOP-16	Telecom Circuit, 1-Func, PDSO16, ROHS COMPLIANT, MO-153AB, TSSOP-16
Is it Rohs certified?	conform to	conform to	conform to	conform to
Parts packaging code	TSSOP	TSSOP	TSSOP	TSSOP
package instruction	TSSOP,	TSSOP,	TSSOP,	TSSOP,
Contacts	16	16	16	16
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
length	5 mm	5 mm	5 mm	5 mm
Number of functions	1	1	1	1
Number of terminals	16	16	16	16
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	TSSOP	TSSOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	OTHER	OTHER
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	4.4 mm	4.4 mm	4.4 mm	4.4 mm
Base Number Matches	1	1	1	1

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