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Datasheet> All Categories > storage> storage> NMC27C128BQE200
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NMC27C128BQE200

Description
16KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28
Categorystorage    storage   
File Size356KB，10 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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NMC27C128BQE200 Overview

16KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28

NMC27C128BQE200 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instructionWDIP, DIP28,.6
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time200 ns
I/O typeCOMMON
JESD-30 codeR-GDIP-T28
JESD-609 codee0
memory density131072 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals28
word count16384 words
character code16000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize16KX8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeWDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE, WINDOW
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage12.75 V
Certification statusNot Qualified
Maximum seat height5.715 mm
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
Base Number Matches1

NMC27C128BQE200 Related Products

NMC27C128BQE200 NMC27C128BQ150 NMC27C128BQ15 NMC27C128BQ25 NMC27C128BQ250 NMC27C128BQM150 NMC27C128BQ20 NMC27C128BQ200 NMC27C128BQE150 NMC27C128BQM200
Description 16KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 IC 16K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM IC 16K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM 16KX8 UVPROM, 250ns, CDIP28, WINDOWED, CERAMIC, DIP-28 16KX8 UVPROM, 250ns, CDIP28, WINDOWED, CERAMIC, DIP-28 IC 16K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM IC 16K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM 16KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 16KX8 UVPROM, 150ns, CDIP28, WINDOWED, CERAMIC, DIP-28 16KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP
package instruction WDIP, DIP28,.6 WDIP, DIP28,.6 WDIP, DIP28,.6 WDIP, DIP28,.6 WDIP, DIP28,.6 WDIP, DIP28,.6 WDIP, DIP28,.6 WDIP, DIP28,.6 WDIP, DIP28,.6 WDIP, DIP28,.6
Contacts 28 28 28 28 28 28 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 200 ns 150 ns 150 ns 250 ns 250 ns 150 ns 200 ns 200 ns 150 ns 200 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit
Memory IC Type UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM
memory width 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28 28 28 28
word count 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words
character code 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C 70 °C 125 °C 70 °C 70 °C 85 °C 125 °C
organize 16KX8 16KX8 16KX8 16KX8 16KX8 16KX8 16KX8 16KX8 16KX8 16KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code WDIP WDIP WDIP WDIP WDIP WDIP WDIP WDIP WDIP WDIP
Encapsulate equivalent code DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 12.75 V 12.75 V 12.75 V 12.75 V 12.75 V 12.75 V 12.75 V 12.75 V 12.75 V 12.75 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.715 mm 5.715 mm 5.715 mm 5.715 mm 5.715 mm 5.715 mm 5.715 mm 5.715 mm 5.715 mm 5.715 mm
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.25 V 5.25 V 5.5 V 5.5 V 5.25 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.75 V 4.75 V 4.5 V 4.5 V 4.75 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY COMMERCIAL COMMERCIAL INDUSTRIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm
Base Number Matches 1 1 1 1 1 1 - - - -

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