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MBM27256-20CV

Description
EPROM, 32KX8, 200ns, MOS, CQCC32
Categorystorage    storage   
File Size314KB,12 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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MBM27256-20CV Overview

EPROM, 32KX8, 200ns, MOS, CQCC32

MBM27256-20CV Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQFJ
package instructionQCCN, LCC32,.45X.55
Contacts32
Reach Compliance Codeunknown
Maximum access time200 ns
I/O typeCOMMON
JESD-30 codeR-XQCC-N32
JESD-609 codee0
memory density262144 bit
memory width8
Number of terminals32
word count32768 words
character code32000
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER
power supply5 V
Programming voltage12.5 V
Certification statusNot Qualified
Maximum slew rate0.1 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Base Number Matches1

MBM27256-20CV Related Products

MBM27256-20CV MBM27256-30CV MBM27256-25CV MBM27256-25Z-X MBM27256-17CV MBM27256-20Z-X
Description EPROM, 32KX8, 200ns, MOS, CQCC32 EPROM, 32KX8, 300ns, MOS, CQCC32 EPROM, 32KX8, 250ns, MOS, CQCC32 EPROM, 32KX8, 250ns, MOS, CDIP28 EPROM, 32KX8, 170ns, MOS, CQCC32 EPROM, 32KX8, 200ns, MOS, CDIP28
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 DIP, DIP28,.6 QCCN, LCC32,.45X.55 DIP, DIP28,.6
Reach Compliance Code unknown unknown unknown compliant unknown compli
Maximum access time 200 ns 300 ns 250 ns 250 ns 170 ns 200 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XQCC-N32 R-XQCC-N32 R-XQCC-N32 R-XDIP-T28 R-XQCC-N32 R-XDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bi
memory width 8 8 8 8 8 8
Number of terminals 32 32 32 28 32 28
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000
Maximum operating temperature 70 °C 70 °C 70 °C 85 °C 70 °C 85 °C
organize 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code QCCN QCCN QCCN DIP QCCN DIP
Encapsulate equivalent code LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 DIP28,.6 LCC32,.45X.55 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 12.5 V 12.5 V 12.5 V 12.5 V 12.5 V 12.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.1 mA 0.1 mA 0.1 mA 0.12 mA 0.1 mA 0.12 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES NO YES NO
technology MOS MOS MOS MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location QUAD QUAD QUAD DUAL QUAD DUAL
Maker - - FUJITSU FUJITSU FUJITSU FUJITSU

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