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NAND08GR3B2CN1

Description
1GX8 FLASH 1.8V PROM, 35ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48
Categorystorage    storage   
File Size887KB,57 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

NAND08GR3B2CN1 Overview

1GX8 FLASH 1.8V PROM, 35ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48

NAND08GR3B2CN1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeTSOP
package instruction12 X 20 MM, PLASTIC, TSOP-48
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time35 ns
JESD-30 codeR-PDSO-G48
JESD-609 codee0
length18.4 mm
memory density8589934592 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals48
word count1073741824 words
character code1000000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1GX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNAND TYPE
width12 mm
Base Number Matches1

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