IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP28,.6 |
Reach Compliance Code | unknown |
Maximum access time | 120 ns |
I/O type | COMMON |
JESD-30 code | R-XDIP-T28 |
JESD-609 code | e0 |
memory density | 65536 bit |
memory width | 8 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 8KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Programming voltage | 13 V |
Certification status | Not Qualified |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.007 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
NM27LC64QE120 | NM27LC64N120 | NM27LC64NE120 | NM27LC64Q120 | |
---|---|---|---|---|
Description | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,8KX8,CMOS,DIP,28PIN,PLASTIC | IC,EPROM,8KX8,CMOS,DIP,28PIN,PLASTIC | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Maximum access time | 120 ns | 120 ns | 120 ns | 120 ns |
I/O type | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-XDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-XDIP-T28 |
JESD-609 code | e0 | e0 | e0 | e0 |
memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
memory width | 8 | 8 | 8 | 8 |
Number of terminals | 28 | 28 | 28 | 28 |
word count | 8192 words | 8192 words | 8192 words | 8192 words |
character code | 8000 | 8000 | 8000 | 8000 |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C |
organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V |
Programming voltage | 13 V | 13 V | 13 V | 13 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
Maximum slew rate | 0.007 mA | 0.0063 mA | 0.007 mA | 0.0063 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 |