KM424C256Z-12 datasheet, PDF - EEWORLD Datasheet

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KM424C256Z-12: DescriptionVideo DRAM, 256KX4, 120ns, CMOS, PZIP28, 0.400 INCH, PLASTIC, ZIP-28; Categorystorage storage; File Size767KB，22 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM424C256Z-12 Overview

Video DRAM, 256KX4, 120ns, CMOS, PZIP28, 0.400 INCH, PLASTIC, ZIP-28

KM424C256Z-12 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	ZIP
package instruction	ZIP, ZIP28,.1
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	120 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT
JESD-30 code	R-PZIP-T28
JESD-609 code	e0
memory density	1048576 bit
Memory IC Type	VIDEO DRAM
memory width	4
Number of functions	1
Number of ports	2
Number of terminals	28
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	ZIP
Encapsulate equivalent code	ZIP28,.1
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	512
Maximum seat height	10.16 mm
Maximum standby current	0.003 A
Maximum slew rate	0.095 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED
width	2.96 mm
Base Number Matches	1

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KM424C256Z-12 Related Products

	KM424C256Z-12	KM424C256J-10	KM424C256J-8	KM424C256Z-8	KM424C256Z-10	KM424C256J-12
Description	Video DRAM, 256KX4, 120ns, CMOS, PZIP28, 0.400 INCH, PLASTIC, ZIP-28	Video DRAM, 256KX4, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28	Video DRAM, 256KX4, 80ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28	Video DRAM, 256KX4, 80ns, CMOS, PZIP28, 0.400 INCH, PLASTIC, ZIP-28	Video DRAM, 256KX4, 100ns, CMOS, PZIP28, 0.400 INCH, PLASTIC, ZIP-28	Video DRAM, 256KX4, 120ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	ZIP	SOJ	SOJ	ZIP	ZIP	SOJ
package instruction	ZIP, ZIP28,.1	SOJ, SOJ28,.44	0.400 INCH, PLASTIC, SOJ-28	ZIP, ZIP28,.1	ZIP, ZIP28,.1	0.400 INCH, PLASTIC, SOJ-28
Contacts	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	120 ns	100 ns	80 ns	80 ns	100 ns	120 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT
JESD-30 code	R-PZIP-T28	R-PDSO-J28	R-PDSO-J28	R-PZIP-T28	R-PZIP-T28	R-PDSO-J28
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	VIDEO DRAM	VIDEO DRAM	VIDEO DRAM	VIDEO DRAM	VIDEO DRAM	VIDEO DRAM
memory width	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1
Number of ports	2	2	2	2	2	2
Number of terminals	28	28	28	28	28	28
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	ZIP	SOJ	SOJ	ZIP	ZIP	SOJ
Encapsulate equivalent code	ZIP28,.1	SOJ28,.44	SOJ28,.44	ZIP28,.1	ZIP28,.1	SOJ28,.44
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	512	512	512	512	512	512
Maximum seat height	10.16 mm	3.76 mm	3.76 mm	10.16 mm	10.16 mm	3.76 mm
Maximum standby current	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A
Maximum slew rate	0.095 mA	0.11 mA	0.13 mA	0.13 mA	0.11 mA	0.095 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	ZIG-ZAG	DUAL	DUAL	ZIG-ZAG	ZIG-ZAG	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	2.96 mm	10.16 mm	10.16 mm	2.96 mm	2.96 mm	10.16 mm
Maker	-	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG

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