ISPLSI2128VL-100LB208 datasheet, PDF

Datasheet> All Categories > Programmable logic devices> Programmable logic> ISPLSI2128VL-100LB208

ISPLSI2128VL-100LB208: DescriptionEE PLD, 13 ns, PBGA208, FBGA-208; CategoryProgrammable logic devices Programmable logic; File Size864KB，18 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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ISPLSI2128VL-100LB208 Overview

EE PLD, 13 ns, PBGA208, FBGA-208

ISPLSI2128VL-100LB208 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	BGA,
Contacts	208
Reach Compliance Code	unknown
maximum clock frequency	77 MHz
JESD-30 code	S-PBGA-B208
JESD-609 code	e0
length	17 mm
Humidity sensitivity level	3
Dedicated input times	4
Number of I/O lines	128
Number of terminals	208
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4 DEDICATED INPUTS, 128 I/O
Output function	MACROCELL
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
Programmable logic type	EE PLD
propagation delay	13 ns
Certification status	COMMERCIAL
Maximum seat height	2.1 mm
Maximum supply voltage	2.7 V
Minimum supply voltage	2.3 V
Nominal supply voltage	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	17 mm
Base Number Matches	1

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ISPLSI2128VL-100LB208 Related Products

	ISPLSI2128VL-100LB208	ISPLSI2128VL-100LQ160	ISPLSI2128VL-100LT100	ISPLSI2128VL-100LT176	ISPLSI2128VL-135LT100	ISPLSI2128VL-135LT176	ISPLSI2128VL-150LT100	ISPLSI2128VL-150LT176	ISPLSI2128VL-150LB100
Description	EE PLD, 13 ns, PBGA208, FBGA-208	EE PLD, 13 ns, PQFP160, PLASTIC, QFP-160	EE PLD, 13 ns, PQFP100, TQFP-100	EE PLD, 13 ns, PQFP176, TQFP-176	EE PLD, 10 ns, PQFP100, TQFP-100	EE PLD, 10 ns, PQFP176, TQFP-176	EE PLD, 8.5 ns, PQFP100, TQFP-100	EE PLD, 8.5 ns, PQFP176, TQFP-176	EE PLD, 8.5 ns, PBGA100, CABGA-100
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	QFP	QFP	QFP	QFP	QFP	QFP	QFP	BGA
package instruction	BGA,	QFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFBGA,
Contacts	208	160	100	176	100	176	100	176	100
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
maximum clock frequency	77 MHz	77 MHz	77 MHz	77 MHz	95 MHz	95 MHz	111 MHz	111 MHz	111 MHz
JESD-30 code	S-PBGA-B208	S-PQFP-G160	S-PQFP-G100	S-PQFP-G176	S-PQFP-G100	S-PQFP-G176	S-PQFP-G100	S-PQFP-G176	S-PBGA-B100
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	17 mm	28 mm	14 mm	24 mm	14 mm	24 mm	14 mm	24 mm	10 mm
Humidity sensitivity level	3	3	3	3	3	3	3	3	3
Dedicated input times	4	4	4	4	4	4	4	4	4
Number of I/O lines	128	128	64	128	64	128	64	128	64
Number of terminals	208	160	100	176	100	176	100	176	100
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	4 DEDICATED INPUTS, 128 I/O	4 DEDICATED INPUTS, 128 I/O	4 DEDICATED INPUTS, 64 I/O	4 DEDICATED INPUTS, 128 I/O	4 DEDICATED INPUTS, 64 I/O	4 DEDICATED INPUTS, 128 I/O	4 DEDICATED INPUTS, 64 I/O	4 DEDICATED INPUTS, 128 I/O	4 DEDICATED INPUTS, 64 I/O
Output function	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	QFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	225	225	240	225	240	225	240	225	240
Programmable logic type	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD
propagation delay	13 ns	13 ns	13 ns	13 ns	10 ns	10 ns	8.5 ns	8.5 ns	8.5 ns
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	2.1 mm	4.1 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.5 mm
Maximum supply voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
Nominal supply voltage	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	BALL	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL
Terminal pitch	1 mm	0.65 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.8 mm
Terminal location	BOTTOM	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30	30
width	17 mm	28 mm	14 mm	24 mm	14 mm	24 mm	14 mm	24 mm	10 mm
Maker	-	-	-	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics

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