IC Socket, PGA225, 225 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Other features | 2.5 OZ. AVG. INSERTION FORCE |
body width | 1.8 inch |
subject depth | 0.165 inch |
body length | 1.8 inch |
Contact structure | 18X18 |
Contact to complete cooperation | TIN LEAD OVER NICKEL |
Contact completed and terminated | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier |
Contact material | BERYLLIUM COPPER ALLOY |
Contact style | RND PIN-SKT |
Device slot type | IC SOCKET |
Type of equipment used | PGA225 |
Shell material | POLYIMIDE |
JESD-609 code | e0 |
Manufacturer's serial number | KS |
Plug contact pitch | 0.1 inch |
Installation method | STRAIGHT |
Number of contacts | 225 |
Maximum operating temperature | 400 °C |
Minimum operating temperature | -269 °C |
PCB contact pattern | RECTANGULAR |
PCB contact row spacing | 0.1 mm |
Terminal pitch | 2.54 mm |
Termination type | SOLDER |
Base Number Matches | 1 |