EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

IDT71V67603S150PF8

Description
Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Categorystorage    storage   
File Size420KB,23 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT71V67603S150PF8 Overview

Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

IDT71V67603S150PF8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instruction14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Contacts100
Reach Compliance Codenot_compliant
ECCN code3A991.B.2.A
Maximum access time3.8 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)150 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density9437184 bit
Memory IC TypeCACHE SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.05 A
Minimum standby current3.14 V
Maximum slew rate0.305 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
Base Number Matches1

IDT71V67603S150PF8 Related Products

IDT71V67603S150PF8 IDT71V67803S166PFG8 IDT71V67803S166PF8 IDT71V67603S150PFI8 IDT71V67603S166PFG8 IDT71V67603S166PF8 IDT71V67803S150PFGI8 IDT71V67603S150PFG8 IDT71V67603S150PFGI8 IDT71V67803S150PFG8
Description Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 256KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100 Cache SRAM, 256KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100 Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Is it Rohs certified? incompatible conform to incompatible incompatible conform to incompatible conform to conform to conform to conform to
Parts packaging code QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP
package instruction 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 LQFP, QFP100,.63X.87 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 LQFP, LQFP, LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, LQFP, QFP100,.63X.87
Contacts 100 100 100 100 100 100 100 100 100 100
Reach Compliance Code not_compliant compliant not_compliant not_compliant compliant compliant compliant compliant compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 3.8 ns 3.5 ns 3.5 ns 3.8 ns 3.5 ns 3.5 ns 3.8 ns 3.8 ns 3.8 ns 3.8 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609 code e0 e3 e0 e0 e3 e0 e3 e3 e3 e3
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit
Memory IC Type CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
memory width 36 18 18 36 36 36 18 36 36 18
Humidity sensitivity level 3 3 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 100 100 100 100 100 100 100 100 100 100
word count 262144 words 524288 words 524288 words 262144 words 262144 words 262144 words 524288 words 262144 words 262144 words 524288 words
character code 256000 512000 512000 256000 256000 256000 512000 256000 256000 512000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 85 °C 70 °C 70 °C 85 °C 70 °C 85 °C 70 °C
organize 256KX36 512KX18 512KX18 256KX36 256KX36 256KX36 512KX18 256KX36 256KX36 512KX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 260 240 240 260 240 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) MATTE TIN TIN LEAD Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed MATTE TIN Matte Tin (Sn) - annealed
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 20 30 20 20 30 20 30 30 30 30
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Maximum clock frequency (fCLK) 150 MHz 166 MHz 166 MHz 150 MHz - - 150 MHz 150 MHz - 150 MHz
I/O type COMMON COMMON COMMON COMMON - - COMMON COMMON - COMMON
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE - - 3-STATE 3-STATE - 3-STATE
Encapsulate equivalent code QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 - - QFP100,.63X.87 QFP100,.63X.87 - QFP100,.63X.87
power supply 3.3 V 3.3 V 3.3 V 3.3 V - - 3.3 V 3.3 V - 3.3 V
Maximum standby current 0.05 A 0.05 A 0.05 A 0.07 A - - 0.07 A 0.05 A - 0.05 A
Minimum standby current 3.14 V 3.14 V 3.14 V 3.14 V - - 3.14 V 3.14 V - 3.14 V
Maximum slew rate 0.305 mA 0.34 mA 0.34 mA 0.325 mA - - 0.325 mA 0.305 mA - 0.305 mA
Base Number Matches 1 1 1 1 1 1 1 - - -
Is it lead-free? - Lead free - - Lead free - Lead free Lead free Lead free Lead free
Maker - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
【Gravity:AS7341 Review】Color Temperature Perception Measurement and Five Color Temperature Conversions
[i=s]This post was last edited by Beifang on 2020-12-30 10:49[/i]1. The value of color temperature can be seen everywhere. It is the temperature corresponding to the same spectrum of standard black bo...
北方 Domestic Chip Exchange
[AT-START-F403A Evaluation] 4. FreeRTOS system based on IAR environment external flash (SPIM) operation evaluation
The last evaluation achieved a rough test of the performance of the external SPIM QSPI Flash. This evaluation will divide the external flash into two parts:0x08400000-0x0840FFFF is used as the data ar...
uuxz99 Domestic Chip Exchange
STM32+ESP8266 obtains weather information and displays it on LCD
[i=s]This post was last edited by liunianu7 on 2018-11-6 10:23[/i] [font=微软雅黑][color=#333333][size=14px][size=4]Hardware platform: stm32f429, esp8266 serial port wifi module.[/size][/size][/color][/fo...
流年u7 stm32/stm8
VCC error in AD09
Help, why does VCC report an error when all the wires are connected properly?...
哼啊啊啊啊 PCB Design
Please teach me how to design an "ideal transformer"
[i=s]This post was last edited by bigbat on 2021-8-9 09:04[/i]I want to first discuss the ideal transformer (no eddy current loss, no magnetic saturation, no wire resistance), and then add constraints...
bigbat Power technology
[Repost] Popular Science: Principles and Applications of Acceleration Sensors
Accelerometers can help your robot understand its environment. Is it climbing a hill? Walking downhill? Did it fall? Or for flying robots, it is also crucial to control its posture. What's more, make ...
皇华Ameya360 Power technology

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号