Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Parts packaging code | QFP |
package instruction | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 |
Contacts | 100 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 3.8 ns |
Other features | PIPELINED ARCHITECTURE |
Maximum clock frequency (fCLK) | 150 MHz |
I/O type | COMMON |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e0 |
length | 20 mm |
memory density | 9437184 bit |
Memory IC Type | CACHE SRAM |
memory width | 36 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX36 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Encapsulate equivalent code | QFP100,.63X.87 |
Package shape | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum standby current | 0.05 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.305 mA |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 20 |
width | 14 mm |
Base Number Matches | 1 |
IDT71V67603S150PF8 | IDT71V67803S166PFG8 | IDT71V67803S166PF8 | IDT71V67603S150PFI8 | IDT71V67603S166PFG8 | IDT71V67603S166PF8 | IDT71V67803S150PFGI8 | IDT71V67603S150PFG8 | IDT71V67603S150PFGI8 | IDT71V67803S150PFG8 | |
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Description | Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cache SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cache SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cache SRAM, 256KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100 | Cache SRAM, 256KX36, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cache SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100 | Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 |
Is it Rohs certified? | incompatible | conform to | incompatible | incompatible | conform to | incompatible | conform to | conform to | conform to | conform to |
Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
package instruction | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | LQFP, QFP100,.63X.87 | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | LQFP, | LQFP, | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, | LQFP, QFP100,.63X.87 |
Contacts | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 3.8 ns | 3.5 ns | 3.5 ns | 3.8 ns | 3.5 ns | 3.5 ns | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns |
Other features | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609 code | e0 | e3 | e0 | e0 | e3 | e0 | e3 | e3 | e3 | e3 |
length | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
memory density | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit |
Memory IC Type | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
memory width | 36 | 18 | 18 | 36 | 36 | 36 | 18 | 36 | 36 | 18 |
Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
word count | 262144 words | 524288 words | 524288 words | 262144 words | 262144 words | 262144 words | 524288 words | 262144 words | 262144 words | 524288 words |
character code | 256000 | 512000 | 512000 | 256000 | 256000 | 256000 | 512000 | 256000 | 256000 | 512000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C |
organize | 256KX36 | 512KX18 | 512KX18 | 256KX36 | 256KX36 | 256KX36 | 512KX18 | 256KX36 | 256KX36 | 512KX18 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 | 260 | 240 | 240 | 260 | 240 | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
Maximum supply voltage (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | MATTE TIN | TIN LEAD | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | MATTE TIN | Matte Tin (Sn) - annealed |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | 20 | 30 | 20 | 20 | 30 | 20 | 30 | 30 | 30 | 30 |
width | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
Maximum clock frequency (fCLK) | 150 MHz | 166 MHz | 166 MHz | 150 MHz | - | - | 150 MHz | 150 MHz | - | 150 MHz |
I/O type | COMMON | COMMON | COMMON | COMMON | - | - | COMMON | COMMON | - | COMMON |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - | 3-STATE | 3-STATE | - | 3-STATE |
Encapsulate equivalent code | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | - | - | QFP100,.63X.87 | QFP100,.63X.87 | - | QFP100,.63X.87 |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V | 3.3 V | - | 3.3 V |
Maximum standby current | 0.05 A | 0.05 A | 0.05 A | 0.07 A | - | - | 0.07 A | 0.05 A | - | 0.05 A |
Minimum standby current | 3.14 V | 3.14 V | 3.14 V | 3.14 V | - | - | 3.14 V | 3.14 V | - | 3.14 V |
Maximum slew rate | 0.305 mA | 0.34 mA | 0.34 mA | 0.325 mA | - | - | 0.325 mA | 0.305 mA | - | 0.305 mA |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
Is it lead-free? | - | Lead free | - | - | Lead free | - | Lead free | Lead free | Lead free | Lead free |
Maker | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |