S-24S30R01/10 datasheet, PDF - EEWORLD Datasheet

S-24S30R01/10: DescriptionNon-Volatile SRAM, 8X8, CMOS, PDIP8; Categorystorage storage; File Size831KB，22 Pages; ManufacturerABLIC

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S-24S30R01/10 Overview

Non-Volatile SRAM, 8X8, CMOS, PDIP8

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ABLIC
package instruction	DIP, DIP8,.3
Reach Compliance Code	compliant
Is Samacsys	N
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
Memory IC Type	NON-VOLATILE SRAM
memory width	8
Number of terminals	8
word count	8 words
character code	8
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8X8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.000001 A
Maximum slew rate	0.01 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

	S-24S30R01/10	S-24S30IF01/10
Description	Non-Volatile SRAM, 8X8, CMOS, PDIP8	Non-Volatile SRAM, 8X8, CMOS, PDSO8
Is it Rohs certified?	incompatible	incompatible
Maker	ABLIC	ABLIC
package instruction	DIP, DIP8,.3	SOP, SOP8,.3
Reach Compliance Code	compliant	compliant
Is Samacsys	N	N
JESD-30 code	R-PDIP-T8	R-PDSO-G8
JESD-609 code	e0	e0
Memory IC Type	NON-VOLATILE SRAM	NON-VOLATILE SRAM
memory width	8	8
Number of terminals	8	8
word count	8 words	8 words
character code	8	8
Maximum operating temperature	70 °C	85 °C
organize	8X8	8X8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP
Encapsulate equivalent code	DIP8,.3	SOP8,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum standby current	0.000001 A	0.000001 A
Maximum slew rate	0.01 mA	0.01 mA
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL
Base Number Matches	1	1

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