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MPC8541PXAQE

Description
32-BIT, 533 MHz, RISC PROCESSOR, PBGA783
Categorysemiconductor    The embedded processor and controller   
File Size1MB,84 Pages
ManufacturerFREESCALE (NXP)
Download Datasheet Parametric View All

MPC8541PXAQE Overview

32-BIT, 533 MHz, RISC PROCESSOR, PBGA783

MPC8541PXAQE Parametric

Parameter NameAttribute value
External data bus width64
Number of terminals783
Minimum operating temperature0.0 Cel
Maximum operating temperature105 Cel
Line speed533 MHz
Processing package description29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
stateActive
microprocessor_microcontroller_peripheral_ic_typeMICROPROCESSOR, RISC
Address bus width64
Number of digits32
boundary scanYES
clock_frequency_max166 MHz
formFLOATING POINT
Integrated cacheYES
jesd_30_codeR-PBGA-B783
jesd_609_codee2
low power modeYES
moisture_sensitivity_level3
Packaging MaterialsPLASTIC/EPOXY
ckage_codeHBGA
packaging shapeRECTANGULAR
Package SizeGRID ARRAY, HEAT SINK/SLUG
eak_reflow_temperature__cel_260
qualification_statusCOMMERCIAL
seated_height_max3.75 mm
Rated supply voltage1.2 V
Minimum supply voltage1.14 V
Maximum supply voltage1.26 V
surface mountYES
CraftsmanshipCMOS
Temperature levelOTHER
terminal coatingTIN COPPER/TIN SILVER
Terminal formBALL
Terminal spacing1 mm
Terminal locationBOTTOM
ime_peak_reflow_temperature_max__s_40
length29 mm
width29 mm
Freescale Semiconductor
Technical Data
MPC8541EEC
Rev. 4, 12/2006
MPC8541E PowerQUICC™ III
Integrated Communications Processor
Hardware Specifications
The MPC8541E integrates a PowerPC™ processor core
built on Power Architecture™ technology with system logic
required for networking, telecommunications, and wireless
infrastructure applications. The MPC8541E is a member of
the PowerQUICC™ III family of devices that combine
system-level support for industry-standard interfaces with
processors that implement the embedded category of the
Power Architecture technology. For functional
characteristics of the processor, refer to the
MPC8555E
PowerQUICC™ III Integrated Communications Processor
Reference Manual.
To locate any published errata or updates for this document
refer to http://www.freescale.com or contact your Freescale
sales office.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 7
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11
Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Ethernet: Three-Speed, MII Management . . . . . . . . . . 20
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
CPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . . . 53
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
System Design Information . . . . . . . . . . . . . . . . . . . . . 75
Document Revision History . . . . . . . . . . . . . . . . . . . . 82
Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . 82
© Freescale Semiconductor, Inc., 2004, 2004, 2006. All rights reserved.

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