IC,FIFO,64X5,ASYNCHRONOUS,TTL,DIP,18PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | DIP, DIP18,.3 |
Reach Compliance Code | unknown |
Is Samacsys | N |
Maximum clock frequency (fCLK) | 10 MHz |
JESD-30 code | R-PDIP-T18 |
JESD-609 code | e0 |
Memory IC Type | OTHER FIFO |
memory width | 5 |
Number of terminals | 18 |
word count | 64 words |
character code | 64 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64X5 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP18,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Maximum slew rate | 0.18 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |