MASK ROM, 4MX8, 200ns, CMOS, PDSO44, PLASTIC, SOP-44
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Hitachi (Renesas ) |
Parts packaging code | SOIC |
package instruction | SOP, SOP44,.63 |
Contacts | 44 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Is Samacsys | N |
Maximum access time | 200 ns |
Spare memory width | 16 |
JESD-30 code | R-PDSO-G44 |
JESD-609 code | e0 |
length | 28.5 mm |
memory density | 33554432 bit |
Memory IC Type | MASK ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP44,.63 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.22 mm |
Maximum standby current | 0.00003 A |
Maximum slew rate | 0.1 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 12.6 mm |
Base Number Matches | 1 |
HN624032FB-20 | HN624032FB-15 | HN624032P-15 | HN624032P-20 | |
---|---|---|---|---|
Description | MASK ROM, 4MX8, 200ns, CMOS, PDSO44, PLASTIC, SOP-44 | MASK ROM, 4MX8, 150ns, CMOS, PDSO44, PLASTIC, SOP-44 | MASK ROM, 4MX8, 150ns, CMOS, PDIP42, PLASTIC, DIP-42 | MASK ROM, 4MX8, 200ns, CMOS, PDIP42, PLASTIC, DIP-42 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
Parts packaging code | SOIC | SOIC | DIP | DIP |
package instruction | SOP, SOP44,.63 | SOP, SOP44,.63 | DIP, DIP42,.6 | DIP, DIP42,.6 |
Contacts | 44 | 44 | 42 | 42 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 200 ns | 150 ns | 150 ns | 200 ns |
Spare memory width | 16 | 16 | 16 | 16 |
JESD-30 code | R-PDSO-G44 | R-PDSO-G44 | R-PDIP-T42 | R-PDIP-T42 |
JESD-609 code | e0 | e0 | e0 | e0 |
length | 28.5 mm | 28.5 mm | 52.8 mm | 52.8 mm |
memory density | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 44 | 44 | 42 | 42 |
word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 | 4000000 | 4000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 4MX8 | 4MX8 | 4MX8 | 4MX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP | DIP | DIP |
Encapsulate equivalent code | SOP44,.63 | SOP44,.63 | DIP42,.6 | DIP42,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.22 mm | 3.22 mm | 5.08 mm | 5.08 mm |
Maximum standby current | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A |
Maximum slew rate | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
width | 12.6 mm | 12.6 mm | 15.24 mm | 15.24 mm |