|
5962-86716012A |
5962-8671601EA |
HI1-0201HS/883 |
Description |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CQCC20, CERAMIC, LCC-20 |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, CERAMIC, DIP-16 |
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, FRIT SEALED, CERDIP-16 |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
Parts packaging code |
QLCC |
DIP |
DIP |
package instruction |
QCCN, LCC20,.35SQ |
CERAMIC, DIP-16 |
DIP-16 |
Contacts |
20 |
16 |
16 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
21 weeks |
19 weeks |
19 weeks |
Analog Integrated Circuits - Other Types |
SPST |
SPST |
SPST |
JESD-30 code |
S-CQCC-N20 |
R-GDIP-T16 |
R-GDIP-T16 |
JESD-609 code |
e0 |
e0 |
e0 |
length |
8.89 mm |
19.5326 mm |
19.05 mm |
Nominal Negative Supply Voltage (Vsup) |
-15 V |
-15 V |
-15 V |
normal position |
NC |
NC |
NC |
Number of channels |
1 |
1 |
1 |
Number of functions |
4 |
4 |
4 |
Number of terminals |
20 |
16 |
16 |
Maximum on-state resistance (Ron) |
50 Ω |
50 Ω |
50 Ω |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
output |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
encapsulated code |
QCCN |
DIP |
DIP |
Encapsulate equivalent code |
LCC20,.35SQ |
DIP16,.3 |
DIP16,.3 |
Package shape |
SQUARE |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER |
IN-LINE |
IN-LINE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT APPLICABLE |
NOT SPECIFIED |
power supply |
+-15 V |
+-15 V |
+-15 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Filter level |
MIL-STD-883 |
MIL-STD-883 |
38535Q/M;38534H;883B |
Maximum seat height |
2.2606 mm |
5.08 mm |
5.08 mm |
Nominal supply voltage (Vsup) |
15 V |
15 V |
15 V |
surface mount |
YES |
NO |
NO |
Maximum disconnect time |
50 ns |
50 ns |
50 ns |
Maximum connection time |
50 ns |
50 ns |
50 ns |
switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
Terminal surface |
Tin/Lead (Sn/Pb) - hot dipped |
Tin/Lead (Sn/Pb) - hot dipped |
Tin/Lead (Sn/Pb) |
Terminal form |
NO LEAD |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal pitch |
1.27 mm |
2.54 mm |
2.54 mm |
Terminal location |
QUAD |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT APPLICABLE |
NOT SPECIFIED |
width |
8.89 mm |
7.62 mm |
7.62 mm |
Base Number Matches |
1 |
1 |
- |